18483298. STACK PACKAGES simplified abstract (SK hynix Inc.)
Contents
STACK PACKAGES
Organization Name
Inventor(s)
Eun Hye Do of Icheon-si Gyeonggi-do (KR)
Chang Shik Jung of Icheon-si Gyeonggi-do (KR)
STACK PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18483298 titled 'STACK PACKAGES
The abstract describes a stack package that includes a substrate with two bond fingers, and two semiconductor dies stacked on top of each other. Connectors are used to connect each semiconductor die to its respective bond finger.
- The stack package includes a substrate with two bond fingers spaced apart.
- Two semiconductor dies are stacked on top of each other within the package.
- Connectors are used to connect each semiconductor die to its corresponding bond finger.
- The second connector has the same length as the first connector.
- This technology enables efficient stacking of semiconductor dies in a compact package.
Potential Applications: - This technology can be used in the manufacturing of integrated circuits. - It can be applied in the development of advanced electronic devices. - The stack package can be utilized in the production of high-performance computing systems.
Problems Solved: - Enables efficient stacking of semiconductor dies. - Provides a compact and reliable packaging solution for electronic components.
Benefits: - Improved connectivity between semiconductor dies and bond fingers. - Enhanced performance and reliability of electronic devices. - Cost-effective packaging solution for integrated circuits.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Integrated Circuits This technology can be commercialized in the semiconductor industry for the production of high-performance electronic devices. It can cater to the growing demand for compact and reliable packaging solutions in various applications.
Questions about Semiconductor Stack Package Technology: 1. How does the stack package technology improve the connectivity between semiconductor dies and bond fingers? - The stack package technology utilizes connectors to establish a secure and efficient connection between semiconductor dies and bond fingers, ensuring reliable performance.
2. What are the potential applications of the stack package technology in the semiconductor industry? - The stack package technology can be applied in the manufacturing of integrated circuits, advanced electronic devices, and high-performance computing systems.
Original Abstract Submitted
A stack package is provided. The stack package includes a package substrate on which a first bond finger and a second bond finger are spaced apart from each other, and a second semiconductor die stacked over a first semiconductor die. A first connector connects the first semiconductor die to the first bond finger. A second connector connects the second semiconductor die to the second bond finger and extends to have substantially the same length as the first connector.
