18480254. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18480254 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application aims to enhance moisture resistance in semiconductor devices.
- The semiconductor device consists of a semiconductor chip, a case, a sealing material within the case, and a lid in close contact with the sealing material.
- The case features at least one projection, while the lid has at least one first hole where the projection fits, securing the lid to the case.
Potential Applications: - This technology can be applied in various electronic devices where moisture resistance is crucial, such as smartphones, tablets, and wearables. - It can also be used in automotive electronics, industrial equipment, and medical devices to protect sensitive semiconductor components from moisture damage.
Problems Solved: - Addresses the issue of moisture ingress in semiconductor devices, which can lead to malfunctions and reduced lifespan. - Improves the reliability and durability of electronic devices operating in humid or wet environments.
Benefits: - Enhances the overall performance and longevity of semiconductor devices. - Reduces the need for frequent maintenance or replacements due to moisture-related issues.
Commercial Applications: Title: Enhanced Moisture Resistance Semiconductor Devices for Electronics Industry This technology can be commercially utilized by semiconductor manufacturers, electronic device companies, and industries requiring moisture-resistant components. It can lead to the development of more robust and reliable electronic products, increasing customer satisfaction and brand reputation.
Questions about the technology: 1. How does the presence of projections in the case improve moisture resistance in semiconductor devices? 2. What are the specific materials used in the sealing material to provide effective moisture protection?
Frequently Updated Research: Stay updated on advancements in semiconductor packaging techniques and materials to further enhance moisture resistance in semiconductor devices.
Original Abstract Submitted
Provided is a semiconductor device with improved moisture resistance. A semiconductor device includes a semiconductor chip, a case, a sealing material arranged in the case and sealing the semiconductor chip, and a lid in close contact with the sealing material, wherein the case has at least one projection, the lid is provided with at least one first hole, and the at least one projection is in the at least one first hole, respectively, whereby the lid is fixed to the case.
