18479820. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18479820 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a complex structure involving multiple layers and components to support and encapsulate semiconductor chips.
- The package includes a first redistribution structure with alternating layers of redistribution and insulating materials.
- A first semiconductor chip is placed on top of this structure.
- A second semiconductor chip is surrounded by the first redistribution structure.
- A first encapsulant covers the first semiconductor chip.
- A second encapsulant encapsulates the second semiconductor chip, with a lower portion surrounded by the first redistribution structure.
- A conductive support layer is present to support the second semiconductor chip and the second encapsulant.
Potential Applications: - This technology can be used in various electronic devices that require advanced semiconductor packaging. - It can be applied in industries such as telecommunications, consumer electronics, and automotive electronics.
Problems Solved: - The technology addresses the need for efficient and reliable packaging solutions for semiconductor chips. - It provides a way to protect and support multiple chips within a single package.
Benefits: - Improved reliability and performance of semiconductor devices. - Enhanced protection for delicate semiconductor components. - Increased efficiency in packaging multiple chips in a compact space.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be commercially utilized in the production of high-performance electronic devices, leading to improved product quality and reliability. The market implications include increased demand for advanced semiconductor packaging solutions in various industries.
Questions about the technology: 1. How does the complex structure of the semiconductor package contribute to the overall performance of the device? 2. What are the specific advantages of using a conductive support layer in semiconductor packaging?
Frequently Updated Research: Ongoing research in semiconductor packaging focuses on enhancing the materials and design of packages to further improve device performance and reliability. Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal results in device manufacturing.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure in which at least one first redistribution layer and at least one first insulating layer are alternately layered; a first semiconductor chip disposed on an upper surface of the first redistribution structure; a second semiconductor chip having a lower portion surrounded by the first redistribution structure; a first encapsulant disposed on the upper surface of the first redistribution structure to encapsulate the first semiconductor chip; a second encapsulant encapsulating the second semiconductor chip and having a lower portion surrounded by the first redistribution structure; and a conductive support layer supporting the second semiconductor chip and the second encapsulant on an upper surface of the second semiconductor chip.
