18475488. SUBSTRATE PROCESSING APPARATUS simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Young Joon Han of Chungcheongnam-do (KR)
Se Min Kang of Chungcheongnam-do (KR)
In Ki Jung of Gyeonggi-do (KR)
Jeong Hyup Yu of Gyeonggi-do (KR)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18475488 titled 'SUBSTRATE PROCESSING APPARATUS
The patent application describes a substrate processing apparatus with a support unit, rear nozzle unit installation unit, rear nozzle unit, rear nozzle driving unit, and liquid inflow preventing unit.
- The support unit holds the substrate in place.
- The rear nozzle unit installation unit includes a sidewall that surrounds the support unit and creates an internal space.
- The rear nozzle unit is movably positioned outside the sidewall to supply liquid to the rear surface of the substrate.
- The rear nozzle driving unit moves the rear nozzle to distribute the liquid.
- The liquid inflow preventing unit is located on a partial sidewall portion and isolates an isolation space from the internal space.
Potential Applications: - Semiconductor manufacturing processes - Thin film deposition - Surface cleaning and treatment in various industries
Problems Solved: - Efficient and precise liquid distribution on substrates - Prevention of liquid inflow into unwanted areas during processing
Benefits: - Improved substrate processing quality - Enhanced control over liquid distribution - Reduced waste and rework in manufacturing processes
Commercial Applications: Title: Advanced Substrate Processing Apparatus for Precision Manufacturing This technology can be used in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions to enhance substrate processing capabilities and improve overall production efficiency.
Questions about the technology: 1. How does the liquid inflow preventing unit contribute to the efficiency of the substrate processing apparatus? 2. What are the key advantages of having a rear nozzle unit that is movably positioned outside the sidewall in this apparatus?
Original Abstract Submitted
A substrate processing apparatus includes a support unit supporting a substrate, a rear nozzle unit installation unit including a sidewall surrounding the support unit and forming an internal space, a rear nozzle unit including a rear nozzle movably disposed outside of the sidewall to supply liquid toward a rear surface of the substrate and a rear nozzle driving unit connected to the rear nozzle through a partial sidewall portion of the sidewall in the internal space and driving the rear nozzle to move, and a liquid inflow preventing unit disposed on the partial sidewall portion of the sidewall and including an isolation space isolated from the internal space.
