18474166. BACKSIDE POWER simplified abstract (ADVANCED MICRO DEVICES, INC.)

BACKSIDE POWER

Organization Name

ADVANCED MICRO DEVICES, INC.

Inventor(s)

Yan Wang of San Jose CA (US)

Kevin Gillespie of Boxborough MA (US)

Samuel Naffziger of Fort Collins CO (US)

Richard Schultz of Fort Collins CO (US)

Raja Swaminathan of Austin TX (US)

Omar Zia of Austin TX (US)

John Wuu of Fort Collins CO (US)

BACKSIDE POWER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18474166 titled 'BACKSIDE POWER

The abstract describes a method for providing backside power in integrated circuits by connecting metal stacks in different circuit dies through a power delivery network located in a passivation layer.

• Method for providing backside power in integrated circuits
• Connects metal stacks in different circuit dies
• Power delivery network located in passivation layer
• Various other methods, systems, and computer-readable media disclosed

Potential Applications: - Semiconductor industry - Electronics manufacturing - Integrated circuit design

Problems Solved: - Efficient power delivery in integrated circuits - Enhanced performance of electronic devices - Improved connectivity between circuit dies

Benefits: - Increased power efficiency - Enhanced performance of integrated circuits - Improved reliability of electronic devices

Commercial Applications: Title: "Innovative Backside Power Delivery Method for Integrated Circuits" Potential commercial uses in semiconductor manufacturing, electronics industry, and integrated circuit design. Market implications include improved efficiency, performance, and reliability of electronic devices.

Prior Art: Readers can explore prior research on backside power delivery methods in integrated circuits, passivation layer technologies, and power delivery networks in semiconductor devices.

Frequently Updated Research: Stay informed about the latest advancements in backside power delivery methods, passivation layer technologies, and integrated circuit design for improved power efficiency and performance.

Questions about Backside Power Delivery Method: 1. How does the method of connecting metal stacks in different circuit dies improve power delivery efficiency? 2. What are the potential challenges in implementing a backside power delivery network in the passivation layer of integrated circuits?

Original Abstract Submitted

A method for providing backside power can include providing a first circuit die having a first metal stack. The method can also include connecting a second metal stack of a second circuit die to the first metal stack of the first circuit die, wherein a backside power delivery network is located in a passivation layer of at least one of the first circuit die or the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.