18473660. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Yongjae Kim of Suwon-si (KR)

Woojin Kim of Suwon-si (KR)

Junghoon Bak of Suwon-si (KR)

Hyunchul Shin of Suwon-si (KR)

Hyeonah Jo of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18473660 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the patent application consists of multiple data storage patterns on a substrate, spaced apart from each other in a parallel direction to the substrate's upper surface.

  • The device includes a first upper conductive line connected to the data storage patterns and extending in the same direction.
  • A second upper conductive line is positioned on the first upper conductive line and also extends in the same direction.
  • A series of via contacts are present between the first and second upper conductive lines, spaced apart from each other in the same direction, and offset from the data storage patterns.

Key Features and Innovation:

  • Multiple data storage patterns on a substrate
  • Upper conductive lines connecting the data storage patterns
  • Via contacts between the upper conductive lines
  • Offset arrangement of via contacts from data storage patterns

Potential Applications: This technology could be used in various semiconductor devices such as memory chips, processors, and other integrated circuits.

Problems Solved: This innovation helps in improving the efficiency and performance of semiconductor devices by optimizing the connection between data storage patterns.

Benefits:

  • Enhanced data storage capabilities
  • Improved conductivity and signal transmission
  • Higher efficiency in semiconductor devices

Commercial Applications: This technology could have significant commercial applications in the semiconductor industry, leading to the development of faster and more reliable electronic devices.

Questions about the Technology: 1. How does the offset arrangement of via contacts contribute to the overall performance of the semiconductor device? 2. What are the potential challenges in implementing this technology on a larger scale in commercial products?

Frequently Updated Research: Researchers are constantly exploring new ways to enhance the design and functionality of semiconductor devices, including the optimization of data storage patterns and conductive lines.


Original Abstract Submitted

A semiconductor device includes a plurality of data storage patterns on a substrate, the plurality of data storage patterns spaced apart from each other in a first direction parallel to an upper surface of the substrate, a first upper conductive line on the plurality of data storage patterns, extending in the first direction and connected to the plurality of data storage patterns, a second upper conductive line on the first upper conductive line and extending in the first direction and a plurality of via contacts between the first upper conductive line and the second upper conductive line and spaced apart from each other in the first direction. The plurality of via contacts are arranged to be offset from the plurality of data storage patterns in the first direction.