18457360. ELECTRONIC APPARATUS simplified abstract (LENOVO (SINGAPORE) PTE. LTD.)
Contents
ELECTRONIC APPARATUS
Organization Name
Inventor(s)
Atsushi Ohyama of Kanagawa (JP)
Akinori Uchino of Kanagawa (JP)
ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18457360 titled 'ELECTRONIC APPARATUS
The abstract describes an electronic apparatus with a unique thermal management system.
- The apparatus includes a first chassis with a motherboard and a processing device, a second chassis connected by a hinge device, an electrical component generating heat, a thermal module for heat dissipation, and a graphite sheet for thermal conduction.
- The connection edge of the first chassis is made of a heat conductive material, with a heat pipe in the thermal module along this edge, and the graphite sheet providing thermal connection between the two chassis.
Potential Applications: - This technology can be applied in electronic devices where efficient heat dissipation is crucial, such as laptops, tablets, and smartphones. - It can also be used in industrial settings where thermal management is essential for the proper functioning of electronic components.
Problems Solved: - Addresses the issue of heat buildup in electronic devices, which can lead to performance degradation and component damage. - Provides a solution for maintaining optimal operating temperatures in compact electronic devices.
Benefits: - Improved performance and longevity of electronic devices. - Enhanced reliability and stability due to effective heat dissipation. - Potential for smaller and more compact electronic designs.
Commercial Applications: - This technology can be utilized by electronics manufacturers to produce more efficient and reliable devices. - It can also be integrated into data centers and server rooms to improve cooling systems and overall energy efficiency.
Prior Art: - Researchers and engineers in the field of thermal management systems for electronic devices may find relevant prior art in studies on heat dissipation techniques and materials.
Frequently Updated Research: - Stay updated on advancements in thermal management technologies for electronic devices to incorporate the latest innovations into product development.
Questions about the technology: 1. How does the graphite sheet improve thermal conduction between the two chassis?
- The graphite sheet acts as a thermal interface material, efficiently transferring heat between the components.
2. What are the potential challenges in implementing this thermal management system in different types of electronic devices?
- The challenges may include adapting the system to varying form factors and component layouts.
Original Abstract Submitted
An electronic apparatus includes a first chassis in which a motherboard mounted with a processing device is mounted, a second chassis provided adjacent to the first chassis, a hinge device that relatively rotatably connects the first chassis to the second chassis, an electrical component that is provided in the first chassis and generates heat, a plate-shaped thermal module that is provided in the first chassis and is thermally connected to the electrical component to radiate heat, and a graphite sheet provided to extend from the first chassis to the second chassis. A connection edge portion of the first chassis is made of a heat conductive material, the thermal module is provided with a heat pipe along the connection edge portion, and the graphite sheet is thermally connected to the heat pipe and the connection edge portion by being laminated and interposed therebetween.
