18443882. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
Contents
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Ryoya Hasebe of Yokkaichi (JP)
Tomoki Akimoto of Yokkaichi (JP)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18443882 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
The semiconductor device described in the abstract consists of a semiconductor chip with two chips, where the second chip is smaller in area than the first chip and is electrically connected to it.
- The second chip is joined to the first chip on the upper surface in a specific region, while the first chip includes a pad exposed in a different region.
- The innovation involves the integration of two chips on a single semiconductor device, allowing for more compact and efficient electronic components.
- This technology enables the creation of smaller and more powerful electronic devices by optimizing the use of space on the semiconductor chip.
- By connecting the two chips electrically, the device can perform more complex functions while maintaining a compact form factor.
- The design of the semiconductor device allows for improved performance and functionality in a smaller package.
Potential Applications: - Consumer electronics - Automotive electronics - Industrial automation - Telecommunications
Problems Solved: - Space optimization on semiconductor chips - Enhanced functionality in compact electronic devices
Benefits: - Improved performance in smaller devices - Increased efficiency in electronic components - Cost-effective manufacturing processes
Commercial Applications: The technology can be utilized in various industries such as consumer electronics, automotive, industrial automation, and telecommunications to enhance the performance and functionality of electronic devices.
Questions about the technology: 1. How does the integration of two chips on a semiconductor device improve its efficiency? 2. What are the potential cost savings associated with using this technology in electronic manufacturing processes?
Original Abstract Submitted
A semiconductor device according to the present embodiment includes a semiconductor chip including a first chip and a second chip. The second chip is joined to the first chip on the first chip such that the second chip is electrically connected to the first chip. The area of the second chip is smaller than the area of the first chip. The second chip is provided in a first region on an upper surface of the first chip and the first chip includes a first pad exposed from the first chip in a second region different from the first region.
