18442484. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Japan Display Inc.)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Yoshikatsu Imazeki of Tokyo (JP)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18442484 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The abstract describes an improvement in the performance of an electronic apparatus, specifically a display apparatus with a unique bump electrode design.
- The display apparatus includes a substrate, wiring, an inorganic insulating layer, and a bump electrode protruding from the insulating layer.
- The bump electrode consists of a first conductor portion made of a first metal material and a second conductor portion made of solder containing tin.
- The first conductor portion is connected to the wiring and includes a first portion overlapping a first opening in the insulating layer and a second portion overlapping a second opening.
Potential Applications: - This technology can be applied in various electronic devices requiring improved performance and reliability. - It can be used in displays, touchscreens, and other electronic components where bump electrodes are utilized.
Problems Solved: - Enhances the performance and reliability of electronic apparatus by providing a unique bump electrode design. - Improves the connection between wiring and bump electrodes, reducing the risk of malfunctions.
Benefits: - Increased performance and reliability of electronic devices. - Enhanced durability and longevity of display apparatus. - Improved connection stability between wiring and bump electrodes.
Commercial Applications: Title: Enhanced Bump Electrode Design for Improved Electronic Performance This technology can be commercially used in the manufacturing of electronic devices such as smartphones, tablets, laptops, and monitors. It can also benefit companies involved in the production of display panels and touchscreens.
Questions about the technology: 1. How does the unique bump electrode design improve the performance of electronic apparatus? - The unique bump electrode design enhances the connection stability between wiring and bump electrodes, leading to improved performance and reliability of electronic devices.
2. What are the potential applications of this technology beyond display apparatus? - This technology can be applied in various electronic components where bump electrodes are used, such as sensors, actuators, and memory devices.
Original Abstract Submitted
Performance of an electronic apparatus is improved. A display apparatus includes: a substrate; a wiring arranged on the substrate; an insulating layer being an inorganic insulating layer made of an inorganic material and covering the wiring; and a bump electrode being connected to the wiring and protruding from the insulating layer. The bump electrode includes: a first conductor portion being made of a first metal material and being connected to the wiring; and a second conductor portion being made of solder containing tin and being arranged on the first conductor portion. The first conductor portion includes: a first portion being connected to the wiring at a position overlapping a first opening formed in the insulating layer; and a second portion separating from the first portion and being connected to the wiring at a position overlapping a second opening formed in the insulating layer.
