18435198. SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Myeongdong Lee of Suwon-si (KR)
SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18435198 titled 'SEMICONDUCTOR DEVICES
The semiconductor device described in the abstract includes an active region defined by an element isolation film in a substrate, a word line extending in a first horizontal direction, a bit line extending in a second horizontal direction crossing the first direction, an additional pad on the active region, and a buried contact connected to the active region through the additional pad.
- The additional pad has a first surface that overlaps the word line vertically and a second surface that does not overlap with the word line vertically, meeting at a cusp.
- The buried contact provides electrical connection to the active region through the additional pad.
- This design allows for efficient electrical connections within the semiconductor device.
- The unique structure of the additional pad ensures proper functionality and connectivity in the device.
- The buried contact enhances the performance and reliability of the semiconductor device.
Potential Applications: - This technology can be used in various semiconductor devices such as memory chips and processors. - It can be applied in the manufacturing of integrated circuits for electronic devices.
Problems Solved: - Improved electrical connectivity within the semiconductor device. - Enhanced performance and reliability of the device.
Benefits: - Efficient electrical connections. - Enhanced performance and reliability. - Improved functionality of semiconductor devices.
Commercial Applications: Title: Enhanced Semiconductor Device Connectivity for Improved Performance This technology can be utilized in the production of memory chips, processors, and other integrated circuits for electronic devices. It can benefit companies in the semiconductor industry by improving the functionality and reliability of their products, ultimately leading to better performance and customer satisfaction.
Questions about Enhanced Semiconductor Device Connectivity for Improved Performance: 1. How does the buried contact enhance the performance of the semiconductor device? The buried contact provides efficient electrical connection to the active region through the additional pad, ensuring improved functionality and reliability of the device.
2. What are the potential applications of this technology in the semiconductor industry? This technology can be applied in various semiconductor devices such as memory chips, processors, and integrated circuits, enhancing their performance and reliability.
Original Abstract Submitted
Provided is a semiconductor device comprising: an active region defined by an element isolation film in a substrate; a word line extending in a first horizontal direction in the substrate; a bit line extending in a second horizontal direction crossing the first horizontal direction on the substrate; an additional pad disposed on the active region; and a buried contact on the additional pad wherein the buried contact is electrically connected to the active region by the additional pad, wherein the additional pad comprises a first surface that overlaps the word line in a vertical direction, and a second surface that is free of overlap with the word line in the vertical direction, and wherein, the first surface meets the second surface at a cusp.
