18433472. DISPLAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.)
Contents
- 1 DISPLAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DISPLAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing display substrate designs in terms of cost-effectiveness?
- 1.11 What specific electronic devices could benefit the most from this display substrate technology?
- 1.12 Original Abstract Submitted
DISPLAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
Organization Name
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Inventor(s)
DISPLAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18433472 titled 'DISPLAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
Simplified Explanation
The patent application describes a display substrate with a display region and a binding region. The display region includes a driving structure layer, an organic insulating layer, and a light-emitting element. The binding region includes a binding structure layer, an organic insulating layer, an isolation dam, and an inorganic encapsulation layer.
- Driving structure layer: Contains a pixel driving circuit.
- Light-emitting element: Connected to the pixel driving circuit.
- Binding structure layer: Contains a power line connected to the pixel driving circuit.
- Isolation groove: Disposed on the organic insulating layer of the binding region.
Potential Applications
The technology described in the patent application could be applied in the manufacturing of high-quality display devices such as OLED screens for smartphones, TVs, and other electronic devices.
Problems Solved
This technology solves the problem of improving the performance and reliability of display substrates by providing a structure that enhances the connection between the driving circuit and the light-emitting element, while also ensuring proper encapsulation and isolation.
Benefits
The benefits of this technology include enhanced display quality, improved durability, and increased efficiency in the production of display devices.
Potential Commercial Applications
- "Innovative Display Substrate Technology for Enhanced Performance and Reliability"
Possible Prior Art
There is no prior art mentioned in the patent application.
Unanswered Questions
How does this technology compare to existing display substrate designs in terms of cost-effectiveness?
The patent application does not provide information on the cost-effectiveness of this technology compared to existing display substrate designs.
What specific electronic devices could benefit the most from this display substrate technology?
The patent application does not specify which electronic devices could benefit the most from this display substrate technology.
Original Abstract Submitted
Provided are a display substrate and a preparation method thereof, and a display device. A display region and a binding region located at one side of the display region are comprised. The display region comprises a driving structure layer, an organic insulating layer disposed on the driving structure layer and a light-emitting element disposed on the organic insulating layer, the driving structure layer comprises a pixel driving circuit, and the light-emitting element is connected with the pixel driving circuit. The binding region comprises a binding structure layer, an organic insulating layer and an isolation dam disposed on the binding structure layer, and an inorganic encapsulation layer disposed on the organic insulating layer and the isolation dam, the binding structure layer comprises a power line connected with the pixel driving circuit; at least one isolation groove is disposed on the organic insulating layer of the binding region.