18432614. SEMICONDUCTOR MODULE simplified abstract (Rohm Co., Ltd.)
Contents
- 1 SEMICONDUCTOR MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing semiconductor module designs in terms of efficiency and performance?
- 1.11 What are the potential challenges or limitations in implementing this semiconductor module technology in practical electronic devices?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Masashi Hayashiguchi of Kyoto-shi (JP)
Takumi Kanda of Kyoto-shi (JP)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18432614 titled 'SEMICONDUCTOR MODULE
Simplified Explanation
The semiconductor module described in the patent application includes a semiconductor device and a bus bar. The device consists of an insulating substrate, a conductive member, switching elements, and first/second input terminals. The substrate has main/back surfaces opposite in a thickness direction, with the conductive member placed on the main surface. The switching elements are connected to the conductive member. The first input terminal, with a first terminal portion, is connected to the conductive member. The second input terminal, including a second terminal portion overlapping with the first terminal portion in the thickness direction, is connected to the switching elements. The second input terminal is separate from the first input terminal and conductive member in the thickness direction. The bus bar comprises first/second terminals. The second terminal, separate from the first terminal in the thickness direction, partially overlaps with the first terminal in the thickness direction. The first/second terminals are connected to the first/second terminal portions, respectively.
- Insulating substrate with main/back surfaces
- Conductive member on the main surface
- Switching elements connected to the conductive member
- First input terminal connected to the conductive member
- Second input terminal separate from the first input terminal and conductive member
- Bus bar with first/second terminals
- Second terminal partially overlapping with the first terminal
- Connection of terminals to terminal portions
Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring efficient semiconductor modules with improved connectivity and performance.
Problems Solved
This technology addresses the need for enhanced semiconductor modules that offer better connectivity, reliability, and performance in electronic devices.
Benefits
The semiconductor module provides improved connectivity, reliability, and performance in electronic devices, leading to enhanced overall functionality and efficiency.
Potential Commercial Applications
The semiconductor module technology could be utilized in industries such as consumer electronics, automotive, telecommunications, and industrial automation for improved device performance and reliability.
Possible Prior Art
One possible prior art could be the use of traditional bus bars and input terminals in semiconductor modules, which may not offer the same level of connectivity and efficiency as the described technology.
Unanswered Questions
How does this technology compare to existing semiconductor module designs in terms of efficiency and performance?
The article does not provide a direct comparison with existing semiconductor module designs to evaluate the efficiency and performance improvements offered by this technology.
What are the potential challenges or limitations in implementing this semiconductor module technology in practical electronic devices?
The article does not address the potential challenges or limitations that may arise during the implementation of this semiconductor module technology in real-world electronic devices.
Original Abstract Submitted
A semiconductor module includes a semiconductor device and bus bar. The device includes an insulating substrate, conductive member, switching elements, and first/second input terminals. The substrate has main/back surfaces opposite in a thickness direction, with the conductive member disposed on the main surface. The switching elements are connected to the conductive member. The first input terminal, including a first terminal portion, is connected to the conductive member. The second input terminal, including a second terminal portion overlapping with the first terminal portion in the thickness direction, is connected to the switching elements. The second input terminal is separate from the first input terminal and conductive member in the thickness direction. The bus bar includes first/second terminals. The second terminal, separate from the first terminal in the thickness direction, partially overlaps with the first terminal in the thickness direction. The first/second terminals are connected to the first/second terminal portions, respectively.
