18426271. STACKED SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
Contents
STACKED SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Bharat Bhushan of Taichung (TW)
Akshay N. Singh of Boise ID (US)
Kunal R. Parekh of Boise ID (US)
STACKED SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18426271 titled 'STACKED SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a semiconductor device assembly that includes a logic die, a top memory die, and one or more intermediate memory dies. The arrangement of the memory dies between the logic die and the top memory die allows for a cost-efficient and low-complexity semiconductor device assembly.
Key Features and Innovation:
- Semiconductor device assembly with a logic die, top memory die, and intermediate memory dies.
- Intermediate memory dies positioned between the top memory die and logic die.
- Front sides of intermediate memory dies face the top memory die, while back sides face the logic die.
- Cost-efficient and low-complexity assembly process.
Potential Applications: The technology can be applied in various semiconductor devices, such as computer processors, mobile devices, and other electronic systems requiring memory integration with logic components.
Problems Solved: This technology addresses the need for a more efficient and simplified semiconductor device assembly process, reducing costs and complexity in manufacturing.
Benefits:
- Cost-efficient assembly process.
- Simplified integration of memory and logic components.
- Improved overall performance of semiconductor devices.
Commercial Applications: Potential commercial applications include the production of computer processors, mobile devices, and other electronic systems that require memory integration with logic components. This technology can lead to cost savings and improved efficiency in manufacturing processes.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching semiconductor device assembly methods, memory integration techniques, and advancements in logic die technology.
Frequently Updated Research: Stay informed about the latest developments in semiconductor device assembly, memory integration, and logic die technology to understand the evolving landscape of this field.
Questions about Semiconductor Device Assembly: 1. What are the key advantages of integrating memory dies between logic and top memory dies in a semiconductor device assembly? 2. How does the arrangement of memory dies contribute to cost-efficiency and reduced complexity in manufacturing processes?
Original Abstract Submitted
A semiconductor device assembly is provided. The semiconductor device assembly includes a logic die, a top memory die, and a one or more intermediate memory dies between the top memory die and the logic die. Front sides of the one or more intermediate memory dies at which active circuitry is disposed face a front side of the top memory die. Back sides of the one or more intermediate memory dies opposite the front sides face a back side of the logic die. In doing so, a cost-efficient, low-complexity semiconductor device can be assembled.
