18411986. COMPOSITIONS FOR POLISHING HARDMASKS AND RELATED SYSTEMS AND METHODS simplified abstract (ENTEGRIS, INC.)

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COMPOSITIONS FOR POLISHING HARDMASKS AND RELATED SYSTEMS AND METHODS

Organization Name

ENTEGRIS, INC.

Inventor(s)

Rajiv K. Singh of Newberry FL (US)

Aditya Dilip Verma of Gainesville FL (US)

Sunny De of Oviedo FL (US)

COMPOSITIONS FOR POLISHING HARDMASKS AND RELATED SYSTEMS AND METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18411986 titled 'COMPOSITIONS FOR POLISHING HARDMASKS AND RELATED SYSTEMS AND METHODS

Simplified Explanation: The patent application describes a system for polishing a hardmask using a composition containing a permanganate ion, a substrate with a hardmask made of specific components, and a chemical mechanical planarization (CMP) apparatus.

  • The system involves a composition with a permanganate oxidizer to polish the hardmask.
  • The substrate has a hardmask made of non-carbon boron, boron-carbon, non-carbon silicon, non-carbon chromium, non-carbon zirconium, or a combination of these components.
  • A CMP apparatus is used to bring the composition and substrate into contact to remove part of the hardmask.

Key Features and Innovation:

  • Utilization of a permanganate ion in the polishing composition.
  • Hardmask composition includes specific non-carbon components.
  • Use of a CMP apparatus for efficient hardmask removal.

Potential Applications: The technology can be applied in semiconductor manufacturing, microelectronics, and nanotechnology industries.

Problems Solved: The system addresses the need for precise and effective polishing of hardmasks in advanced manufacturing processes.

Benefits:

  • Improved precision in hardmask polishing.
  • Enhanced efficiency in substrate processing.
  • Potential cost savings in manufacturing operations.

Commercial Applications: The technology can be utilized in semiconductor fabrication facilities, electronic device manufacturing plants, and research institutions.

Questions about Hardmask Polishing: 1. What are the key components of the hardmask in this system? 2. How does the CMP apparatus contribute to the efficiency of hardmask removal?

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Original Abstract Submitted

A system for polishing a hardmask comprises a composition comprising a permanganate ion of a permanganate oxidizer; a substrate comprising a hardmask that comprises at least one of a non-carbon boron component, a boron-carbon component, a non-carbon silicon component, a non-carbon chromium component, a non-carbon zirconium component, or any combination thereof; and a chemical mechanical planarization (CMP) apparatus configured to bring the composition and the substrate into contact so as to remove at least a portion of the hardmask of the substrate.

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