18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE
Organization Name
Inventor(s)
Seunghyun Cho of Suwon-si (KR)
CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18403864 titled 'CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE
The chip on film package described in the patent application consists of a flexible base film with a chip mounting region, wirings extending from the chip mounting region, a semiconductor chip mounted on the base film, a heat dissipation layer with a laser-induced carbon material, and an insulating layer covering the heat dissipation layer.
- The package includes a flexible base film with a chip mounting region.
- Wirings extend from the chip mounting region in a parallel direction to the base film.
- A semiconductor chip is mounted on the base film and connected to the wirings.
- A heat dissipation layer, containing a laser-induced carbon material, is provided on the second surface of the base film.
- An insulating layer covers the heat dissipation layer on the base film.
Potential Applications: - This technology can be used in electronic devices where heat dissipation is crucial, such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Improved heat dissipation in electronic devices. - Enhanced reliability and performance of semiconductor chips. - Space-saving design for compact electronic devices.
Benefits: - Efficient heat dissipation for better device performance. - Increased longevity of semiconductor chips. - Compact and lightweight design for portable electronic devices.
Commercial Applications: Heat dissipation technology for electronic devices: Market Implications and Potential Commercial Uses
Questions about the technology: 1. How does the laser-induced carbon material in the heat dissipation layer improve thermal management? 2. What are the specific advantages of using a flexible base film in this chip on film package design?
Original Abstract Submitted
A chip on film package includes a flexible base film having a first surface and a second surface opposite to the first surface, the base film having a chip mounting region on the first surface; a plurality of wirings extending from the chip mounting region on the first surface of the base film in a first direction parallel to an extending direction of the base film; a semiconductor chip mounted on the chip mounting region on the first surface of the base film and electrically connected to the plurality of wirings; a heat dissipation layer provided to have a predetermined thickness in a depth direction from the second surface of the base film in an area overlapping the chip mounting region, the heat dissipation layer including a laser-induced carbon material; and an insulating layer covering the heat dissipation layer on the second surface of the base film.
