18398043. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kenshi Terashima of Matsumoto-city (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18398043 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a semiconductor device with a semiconductor chip bonded to a substrate, a heat dissipation base with a fastening portion, and a case with a protection portion. The case is positioned on the heat dissipation base, accommodating the substrate in an opening area and aligning the protection portion with the fastening portion.
Key Features and Innovation:
- Semiconductor chip bonded to a substrate
- Heat dissipation base with fastening portion
- Case with protection portion and fixing hole
- Strategic positioning of components for efficient heat dissipation
Potential Applications: This technology can be utilized in various electronic devices requiring effective heat dissipation, such as computers, smartphones, and automotive electronics.
Problems Solved: This innovation addresses the challenge of managing heat dissipation in semiconductor devices, ensuring optimal performance and longevity.
Benefits:
- Improved heat dissipation efficiency
- Enhanced overall performance of semiconductor devices
- Extended lifespan of electronic components
Commercial Applications: The technology can be applied in the manufacturing of consumer electronics, industrial equipment, and automotive systems to enhance performance and reliability.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of semiconductor device packaging and heat dissipation techniques.
Frequently Updated Research: Stay informed about the latest advancements in semiconductor device packaging and heat dissipation technologies to optimize the performance of electronic devices.
Questions about Semiconductor Device Heat Dissipation: 1. How does the strategic positioning of components in this semiconductor device improve heat dissipation efficiency? 2. What are the potential long-term benefits of implementing this technology in electronic devices?
Original Abstract Submitted
A semiconductor device, including: a semiconductor chip bonded to a substrate; a heat dissipation base including a fastening portion connected to a heat dissipation portion, the substrate being disposed in a substrate area on the heat dissipation portion, the fastening portion having a fastening hole formed therein; and a case including a protection portion beside an opening area, the protection portion having a fixing hole formed therein corresponding to the fastening hole, the case being disposed on the heat dissipation base so that the substrate is accommodated in the opening area and the protection portion is disposed on the fastening portion. A boundary between the fastening portion and the heat dissipation portion is located outside the opening area of the case in the plan view, and the fastening portion is located lower than the front surface of the heat dissipation portion in a side view of the semiconductor device.
