18396256. SUBSTRATE POLISHING APPARATUS simplified abstract (EBARA CORPORATION)
Contents
SUBSTRATE POLISHING APPARATUS
Organization Name
Inventor(s)
Masaki Kinoshita of Tokyo (JP)
SUBSTRATE POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18396256 titled 'SUBSTRATE POLISHING APPARATUS
Simplified Explanation: The patent application aims to improve the accuracy of measurements in an optical surface monitoring system by addressing the influence of relative velocity differences between a substrate and a polishing table.
Key Features and Innovation:
- Polishing apparatus with a polishing table, motor, substrate holding head, light source, optical head, optical detector, shutter, and control device.
- Optical head inside the polishing table projects light towards the substrate and receives reflected light.
- Optical detector detects the received light, and the shutter controls the exposure time for capturing the light.
- Control device adjusts the exposure time based on the substrate's polishing condition.
Potential Applications: This technology can be applied in industries that require precise optical surface monitoring, such as semiconductor manufacturing, optics production, and precision engineering.
Problems Solved: The technology addresses the issue of measurement inaccuracies caused by differences in relative velocity between the substrate and the polishing table in optical surface monitoring systems.
Benefits:
- Improved measurement accuracy in optical surface monitoring.
- Enhanced control over exposure time for capturing light.
- Increased efficiency in polishing processes.
Commercial Applications: Potential commercial applications include optical surface monitoring systems for semiconductor fabrication, optical lens production, and other precision manufacturing industries.
Prior Art: Readers can explore prior art related to optical surface monitoring systems, optical detectors, and control devices in precision engineering and manufacturing fields.
Frequently Updated Research: Stay updated on advancements in optical surface monitoring technology, precision polishing techniques, and control systems for industrial applications.
Questions about Optical Surface Monitoring Systems: 1. How does the technology address the influence of relative velocity differences between the substrate and the polishing table? 2. What are the potential commercial uses of this innovation in precision manufacturing industries?
Original Abstract Submitted
To remove or reduce the influence on the measurement accuracy due to a difference of the relative velocity between a substrate and a polishing table in an optical surface monitoring system. A substrate polishing apparatus includes a polishing table, a motor, a substrate holding head, a light source, an optical head, an optical detector, a shutter, and a control device. The motor is for rotating the polishing table. The substrate holding head is configured to hold a substrate. The optical head is disposed inside the polishing table. The optical head includes a light projection port and a light reception port. The light projection port is disposed to project light from the light source toward the substrate held by the substrate holding head. The light reception port is disposed to receive light reflected from the substrate held by the substrate holding head. The optical detector is for detecting the light received at the light reception port. The shutter is for controlling an exposure time during which the light is captured in the optical detector. The control device is for controlling the operation of the shutter so as to change the exposure time based on the polishing condition of the substrate.
