18393884. SUBSTRATE PROCESSING APPARATUS simplified abstract (SEMES CO., LTD.)

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SUBSTRATE PROCESSING APPARATUS

Organization Name

SEMES CO., LTD.

Inventor(s)

Jongdoo Lee of Cheonan-si (KR)

Taejong Choi of Asan-si (KR)

Juyeon Song of Sokcho-si (KR)

Sangmin Lee of Seoul-si (KR)

SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18393884 titled 'SUBSTRATE PROCESSING APPARATUS

The patent application describes a substrate processing apparatus with features to prevent friction and detect deformation in a conductor.

  • The apparatus includes a body with a substrate treatment space, a fluid supply unit, a fluid exhaust line, a clamp body, and a friction prevention member.
  • A conductor extends along the outer rim of the friction prevention member, and a processor detects conductor deformation.
  • The apparatus aims to improve substrate processing efficiency and prevent damage due to friction.
  • The innovation lies in the integration of the conductor for deformation detection, enhancing the apparatus's functionality and safety.
  • By detecting conductor deformation, the processor can alert operators to potential issues and prevent further damage.

Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production

Problems Solved: - Friction between components in substrate processing apparatus - Deformation detection in critical parts - Enhancing safety and efficiency in substrate treatment processes

Benefits: - Improved substrate processing efficiency - Early detection of potential issues - Enhanced safety measures in manufacturing processes

Commercial Applications: - Semiconductor industry - Electronics manufacturing - Solar energy sector

Questions about the technology: 1. How does the apparatus prevent friction between components? 2. What are the specific benefits of detecting conductor deformation in the substrate processing apparatus?


Original Abstract Submitted

Provided is a substrate processing apparatus including a body having a substrate treatment space therein, a fluid supply unit configured to supply a treatment fluid to the substrate treatment space, a fluid exhaust line to exhaust the treatment fluid from the substrate treatment space, a clamp body configured to surround and fix the body, a friction prevention member arranged between the body and the clamp body and configured to prevent friction between the body and the clamp body, a conductor extending along at least a portion of an outer rim of the friction prevention member, and a processor configured to detect whether the conductor has been deformed, based on an output signal that is output in response to an electrical signal applied to the conductor.