18389775. WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF simplified abstract (NICHIA CORPORATION)
Contents
WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF
Organization Name
Inventor(s)
Atsushi Hosokawa of Tokushima-shi (JP)
Masaaki Katsumata of Anan-shi (JP)
WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18389775 titled 'WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF
The abstract describes a wiring substrate with a base body, a conductive portion in a via hole, and a wiring portion connected to the conductive portion on the body's surface. The conductive portion contains a first conductive member with copper particles and resin, including small and large-sized particles. The wiring portion contains a second conductive member with copper particles of similar sizes. The first member has a lower proportion of small-sized particles compared to the second member.
- The wiring substrate includes a base body, a conductive portion, and a wiring portion.
- The conductive portion contains a first member with copper particles and resin, including small and large-sized particles.
- The wiring portion contains a second member with copper particles of similar sizes.
- The first member has a lower proportion of small-sized particles compared to the second member.
- Potential Applications
This technology can be used in various electronic devices and circuits where a reliable and efficient wiring substrate is required.
- Problems Solved
This technology addresses the need for a wiring substrate with improved conductivity and reliability in electronic applications.
- Benefits
- Enhanced conductivity due to the presence of copper particles - Improved reliability in electronic circuits - Cost-effective manufacturing process
- Commercial Applications
This technology can be applied in the manufacturing of printed circuit boards, electronic components, and other electrical devices, catering to industries such as consumer electronics, telecommunications, and automotive.
- Questions about the Technology
- 1. How does the presence of copper particles enhance the conductivity of the wiring substrate?
- Questions about the Technology
Copper particles in the conductive portion improve the substrate's conductivity by providing a path for the flow of electrical current.
- 2. What advantages does the use of small and large-sized particles in the conductive portion offer in terms of performance and reliability?
The combination of small and large-sized particles in the conductive portion ensures a more uniform distribution of copper throughout the substrate, enhancing its performance and reliability.
Original Abstract Submitted
A wiring substrate including a base body provided with a via hole, a conductive portion disposed in the via hole, and a wiring portion electrically connected to the conductive portion and disposed on a surface of the body. The conductive portion includes a first conductive member containing copper particles and a resin. The first member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. The wiring portion includes a second conductive member containing copper particles. The second member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. A weight proportion of the small-sized particles in the first member is lower than a weight proportion of the small-sized particles in the second member.