18383035. SEMICONDUCTOR DEVICE (UNITED MICROELECTRONICS CORP.)
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Chun-Ting Chiang of Kaohsiung City TW
Tien-Shan Hsu of Tainan City TW
Po-Chang Lin of Tainan City TW
Hao-Che Feng of Kaohsiung City TW
Ping-Wei Huang of Pingtung County TW
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18383035 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device includes a first fin-shaped structure and a second fin-shaped structure on a substrate, a bump between the first fin-shaped structure and the second fin-shaped structure, a first recess between the first fin-shaped structure and the bump, and a second recess between the second fin-shaped structure and the bump. Preferably, a top surface of the bump includes a curve concave upward, a width of the bump is greater than twice the width of the first fin-shaped structure, and a height of the bump is less than one fourth of the height of the first fin-shaped structure.