18382661. SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18382661 titled 'SEMICONDUCTOR DEVICES
The semiconductor device described in the patent application consists of a wiring line on a substrate, with a first line portion in a first direction and a head hammer pattern connected to the end of the first line portion. There is also a second wiring line spaced from the first wiring line in a second direction perpendicular to the first direction, with a first contact plug electrically connecting the first and second line portions.
- The device features a unique design with a first line portion, a head hammer pattern, and a second line portion connected by a first contact plug.
- The first contact plug is positioned adjacent to the ends of the first and second line portions in the first direction.
- The first contact plug has a bottom surface higher than the bottom surfaces of the wiring lines.
- The upper surface of the head hammer pattern contacts an insulation material.
Potential Applications: - This technology can be used in the manufacturing of semiconductor devices for various electronic applications. - It can improve the efficiency and performance of integrated circuits and electronic components.
Problems Solved: - Provides a reliable and efficient way to connect different wiring lines in a semiconductor device. - Ensures proper electrical connections between components.
Benefits: - Enhanced performance and reliability of semiconductor devices. - Improved manufacturing processes for electronic components.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Electronic Components This technology can be utilized in the production of advanced electronic devices such as smartphones, computers, and other consumer electronics. It can also benefit industries that rely on high-performance integrated circuits and semiconductor devices.
Questions about the technology: 1. How does the positioning of the first contact plug improve the efficiency of the semiconductor device? 2. What are the advantages of having a head hammer pattern in the device design?
Original Abstract Submitted
A semiconductor device includes a wiring line on a substrate, a first line portion having a line shape in a first direction, a head hammer pattern connected to an end of the first line portion in the first direction; a second wiring line spaced from the first wiring line in a second direction perpendicular to the first direction, the second wiring line including a second line portion parallel to the first line portion; a first contact plug electrically connecting the first line portion and the second line portion, the first contact plug being positioned adjacent to the first end of the first line portion and a second end of the second line portion in the first direction. The first contact plug has a bottom surface higher than a bottom surface of the first and second wiring lines. The upper surface of the first head hammer pattern contacts an insulation material.
