18380854. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
JAE CHOON Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380854 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a substrate, a semiconductor die mounted on the substrate, and a heat spreader that covers the semiconductor die. The heat spreader is composed of an upper plate portion, a base portion, and a sidewall portion that connects the upper plate portion to the base portion. The upper plate portion and the sidewall portion create a cavity underneath. The base portion, which is situated on the substrate, extends horizontally from the sidewall portion and includes multiple first through holes. It has a bottom surface at the same level as the bottom surface of the sidewall portion and a height less than or equal to that of the sidewall portion.
- The semiconductor package includes a heat spreader with a unique design, consisting of an upper plate portion, a base portion, and a sidewall portion.
- The base portion of the heat spreader is situated on the substrate and features multiple first through holes for enhanced heat dissipation.
- The height of the base portion is less than or equal to that of the sidewall portion, ensuring efficient thermal management within the package.
- The innovative design of the heat spreader contributes to improved overall performance and reliability of the semiconductor package.
- The configuration of the heat spreader allows for effective heat dissipation, which is crucial for maintaining the optimal operating temperature of the semiconductor die.
Potential Applications: - This technology can be applied in various electronic devices that require efficient thermal management, such as computers, smartphones, and automotive electronics. - It can also be utilized in industrial applications where heat dissipation is a critical factor for the performance and longevity of electronic components.
Problems Solved: - The semiconductor package addresses the challenge of thermal management in electronic devices by providing an effective heat spreader design. - It ensures that the semiconductor die operates within the specified temperature range, preventing overheating and potential damage.
Benefits: - Improved thermal performance and reliability of electronic devices. - Enhanced overall efficiency and longevity of semiconductor components. - Better heat dissipation capabilities leading to optimized performance.
Commercial Applications: Title: Enhanced Thermal Management Solution for Electronic Devices This technology can be commercialized in the consumer electronics industry for the development of high-performance devices with superior thermal management capabilities. It can also find applications in the automotive sector for improving the efficiency and reliability of electronic systems in vehicles.
Questions about Semiconductor Package Heat Spreader: 1. How does the design of the heat spreader contribute to efficient heat dissipation within the semiconductor package? - The design of the heat spreader, with its unique configuration of the upper plate, base, and sidewall portions, allows for effective heat dissipation by creating a cavity underneath and incorporating multiple first through holes in the base portion.
2. What are the potential implications of using this innovative heat spreader design in electronic devices? - By implementing this innovative heat spreader design, electronic devices can benefit from improved thermal management, enhanced performance, and increased reliability, ultimately leading to a better user experience.
Original Abstract Submitted
A semiconductor package includes a substrate, a semiconductor die on the substrate, a heat spreader covering the semiconductor die. The heat spreader includes an upper plate portion, a base portion, and a sidewall portion connecting the upper plate portion to the base portion. The upper plate portion and the sidewall portion define an underlying cavity. The base portion is disposed on the substrate, extends from an exterior side of the sidewall portion in a horizontal direction, includes a plurality of first through holes, has a bottom surface at the same level as a bottom surface of the sidewall portion, and has a height in a vertical direction from a lowermost portion to an uppermost portion thereof less than or equal to that of the sidewall portion.
