18379034. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18379034 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate, an interposer with first upper pads, a first semiconductor chip with first lower pads connected to the first set of upper pads, and a plurality of first and second pins on the top surface of the chip.
- The package includes a package substrate, an interposer, and a semiconductor chip.
- The interposer has first upper pads, which are connected to the first lower pads on the semiconductor chip.
- The first semiconductor chip has a first region and a second region on its top surface.
- The first set of upper pads on the interposer are connected to the first lower pads on the semiconductor chip.
- The first and second pins on the top surface of the semiconductor chip are spaced apart by different distances.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of semiconductor chips in high-speed applications.
Problems Solved: - Enhances the connectivity and signal transmission between the semiconductor chip and the package substrate. - Optimizes the layout of pins on the semiconductor chip for improved functionality.
Benefits: - Increased efficiency and performance of semiconductor packages. - Enhanced signal integrity and reduced signal interference. - Improved thermal management for better overall reliability.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics This technology can be applied in the production of high-speed processors, memory modules, and communication devices, catering to industries such as telecommunications, computing, and consumer electronics.
Questions about the technology: 1. How does the spacing of pins on the semiconductor chip impact signal transmission? 2. What are the key advantages of using an interposer in semiconductor packaging?
Frequently Updated Research: Researchers are continually exploring new materials and designs to further enhance the performance and reliability of semiconductor packages. Stay updated on the latest advancements in semiconductor packaging technology for cutting-edge applications.
Original Abstract Submitted
A semiconductor package includes a package substrate, an interposer on the package substrate and including first upper pads, the first upper pads including a first set of upper pads and a second set of upper pads, a first semiconductor chip on the interposer and comprising first lower pads respectively connected to the first set of upper pads, a plurality of first pins on a first top surface of the first semiconductor chip and substantially uniformly spaced apart by a first distance, and a plurality of second pins on the first top surface of the first semiconductor chip and substantially uniformly spaced apart by a second distance that is different from the first distance, where the first top surface of the first semiconductor chip includes a first region and a second region that does not overlap the first region.
