18374718. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Hyungeun Choi of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18374718 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application includes a complex structure involving lower and upper bonding structures, transistors, memory cell structures, connection structures, and through vias.
- Lower bonding structure consists of lower substrate, lower dielectric structure, and a transistor.
- Upper bonding structure includes upper dielectric structure, upper substrate, and a memory cell structure.
- Connection structure is located on the upper bonding structure.
- A first through via electrically connects the transistor to the memory cell structure.
- The transistor overlaps the memory cell structure, and the first through via penetrates the upper substrate and the upper dielectric structure.
Potential Applications: - This technology can be applied in the semiconductor industry for advanced memory devices. - It can be used in the development of high-performance computing systems.
Problems Solved: - This technology addresses the need for compact and efficient semiconductor devices with improved connectivity.
Benefits: - Enhanced performance and connectivity in semiconductor devices. - Increased efficiency and compactness in memory cell structures.
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Memory Systems This technology can be utilized in the production of high-speed memory devices for various electronic applications, including smartphones, computers, and data storage systems. The market implications include improved performance and reliability in memory systems, leading to enhanced user experience and increased demand in the semiconductor industry.
Questions about the Technology: 1. How does this semiconductor device improve connectivity and performance in memory systems? 2. What are the potential commercial applications of this advanced semiconductor technology?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor technology, particularly in the development of memory devices and connectivity solutions. Explore research papers and industry publications for insights into the evolving landscape of semiconductor devices.
Original Abstract Submitted
Disclosed are semiconductor devices and their fabrication methods. The semiconductor device includes a lower bonding structure that includes a lower substrate, a lower dielectric structure on the lower substrate, and a transistor between the lower substrate and the lower dielectric structure, an upper bonding structure that includes an upper dielectric structure on the lower dielectric structure, an upper substrate on the upper dielectric structure, and a memory cell structure between the upper substrate and the upper dielectric structure, a connection structure on the upper bonding structure, and a first through via that electrically connects the transistor to the memory cell structure. The transistor overlaps the memory cell structure. The first through via penetrates the upper substrate and the upper dielectric structure.
