18352552. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
HYUNGJUNE Kim of Suwon-si (KR)
BYUNGYUN Kang of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18352552 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a substrate with wires and dummy wires on both sides, connected by through vias and dummy through vias that are laterally offset and physically separated from the wires.
- The device includes a substrate with wires and dummy wires on both sides.
- Through vias connect the wires on each side of the substrate.
- Dummy through vias are laterally offset and physically separated from the wires.
- The dummy through vias are not aligned with the wires, providing a unique configuration.
- This design helps improve the performance and reliability of the semiconductor device.
Potential Applications: - This technology can be used in various semiconductor devices such as integrated circuits and microprocessors. - It can enhance the efficiency and functionality of electronic devices in industries like telecommunications, computing, and consumer electronics.
Problems Solved: - The lateral offset of dummy through vias helps reduce signal interference and crosstalk between wires on the substrate. - It improves the overall performance and reliability of the semiconductor device.
Benefits: - Enhanced signal integrity and reduced interference. - Improved reliability and performance of semiconductor devices. - Potential for increased efficiency in electronic systems.
Commercial Applications: Title: Enhanced Semiconductor Devices for Improved Performance This technology can be utilized in the production of high-performance electronic devices, leading to better functionality and reliability. Industries such as telecommunications, computing, and consumer electronics can benefit from the enhanced performance and efficiency offered by this innovation.
Questions about Semiconductor Devices: 1. How does the lateral offset of dummy through vias improve the performance of semiconductor devices?
- The lateral offset helps reduce signal interference and crosstalk, leading to enhanced signal integrity and overall device reliability.
2. What are the potential applications of this technology in the electronics industry?
- This technology can be used in various semiconductor devices, including integrated circuits and microprocessors, to improve efficiency and functionality.
Original Abstract Submitted
A semiconductor device according to the disclosure includes: a substrate including a first side and a second side opposite each other with a thickness therebetween, a first wire disposed on the first side of the substrate, a first dummy wire disposed on the first side of the substrate and spaced apart from the first wire, a second wire disposed on the second side of the substrate, a second dummy wire disposed on the second side of the substrate and spaced apart from the second wire, a through via passing through the substrate and connecting the first wire and the second wire, and a plurality of dummy through vias passing through the substrate , wherein the plurality of dummy through vias are laterally offset and physically separated from the first wire and the second wire, wherein a center of at least one of the plurality of dummy through vias is laterally offset from an edge of at least one of the first dummy wire and the second dummy wire.
