18340193. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18340193 titled 'SEMICONDUCTOR PACKAGES
The semiconductor package described in the abstract includes a front redistribution structure with multiple redistribution layers and connection bumps within a recess, as well as an underfill material.
- The front redistribution structure consists of an insulating layer with front redistribution layers, including a first layer on a lower level and second layers on a higher level.
- The connection bumps include a first bump connected to the first redistribution layer and a second bump connected to the outer redistribution layer within the recess.
- The underfill extends along the side surfaces of the second bump and a dam within the recess.
Potential Applications: - This semiconductor package design can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial machinery, and medical devices.
Problems Solved: - Provides improved electrical connections within the semiconductor package. - Enhances the reliability and performance of electronic devices.
Benefits: - Increased efficiency and functionality of electronic devices. - Enhanced durability and longevity of semiconductor packages.
Commercial Applications: - This technology can be utilized by semiconductor manufacturers, electronics companies, and other industries requiring advanced packaging solutions.
Questions about Semiconductor Package Design: 1. How does the front redistribution structure contribute to the overall performance of the semiconductor package? 2. What are the specific advantages of using connection bumps within a recess in this design?
Original Abstract Submitted
A semiconductor package including: a front redistribution structure including an insulating layer defining an upper surface, a lower surface opposing the upper surface, and a side surface, front redistribution layers including a first redistribution layer on a first level adjacent to the lower surface and second redistribution layers on a second level higher than the first level relative to the lower surface, the second redistribution layers having an inner redistribution layer and an outer redistribution layer, a recess exposing at least a portion of the outer redistribution layer, and a dam on at least one side of the recess; connection bumps including a first bump electrically connected to the first redistribution layer and a second bump electrically connected to the outer redistribution layer within the recess; and an underfill that extends along a side surface of the second bump and a side surface of the dam within the recess.
