18294638. SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Contents
SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME
Organization Name
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventor(s)
Yutaka Ootaki of Kanagawa (JP)
SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18294638 titled 'SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME
The patent application describes a lead frame designed to provide effective heat dissipation for semiconductor chips in large-scale circuits.
- The lead frame includes a mounting surface for the semiconductor chip, made of a material with heat dissipation properties, at the center of a front surface.
- Surrounding the mounting portion are heat-dissipating portions composed of plate-shaped heat-dissipating fins.
- When the lead frame is attached to the rear surface of the semiconductor device package, the mounting surface is fitted into an opening in the package.
Potential Applications: - Semiconductor industry for large-scale circuits - Electronics manufacturing for improved heat dissipation in devices
Problems Solved: - Inadequate heat dissipation for semiconductor chips in large-scale circuits - Overheating issues in electronic devices
Benefits: - Enhanced heat dissipation efficiency - Improved performance and reliability of semiconductor chips - Extended lifespan of electronic devices
Commercial Applications: Title: Advanced Heat-Dissipating Lead Frame Technology for Semiconductor Industry This technology can be utilized in the production of high-performance electronic devices, such as computers, smartphones, and automotive electronics, to ensure optimal heat management and overall device performance.
Prior Art: Researchers and engineers in the field of semiconductor packaging and heat dissipation technologies may find relevant prior art in patents related to lead frame designs, heat sink structures, and semiconductor chip packaging methods.
Frequently Updated Research: Ongoing research in the semiconductor industry focuses on developing innovative materials and structures for more efficient heat dissipation in electronic devices. Stay updated on industry publications and conferences for the latest advancements in heat management technologies.
Questions about Heat-Dissipating Lead Frame Technology: 1. How does the material composition of the mounting surface contribute to heat dissipation efficiency? The material composition of the mounting surface plays a crucial role in enhancing heat dissipation by efficiently transferring heat away from the semiconductor chip.
2. What are the key factors to consider when designing heat-dissipating fins for optimal performance? The design of heat-dissipating fins should take into account factors such as surface area, spacing, and material properties to maximize heat dissipation effectiveness.
Original Abstract Submitted
To provide a lead frame with a high heat dissipation effect capable of taking effective heat dissipation measures even for semiconductor chips in large-scale circuits. A heat-dissipating lead frame includes: a mounting surface for mounting a semiconductor chip formed of a material having heat dissipation properties and provided at a center on a front surface side of a mounting portion; and a number of heat-dissipating portions composed of a number of plate-shaped heat-dissipating fins provided around the mounting portion. With the mounting front surface facing the front surface of the semiconductor package, the mounting surface is fitted into an opening provided in a semiconductor device package, and the lead frame is attached to the rear surface of the semiconductor device package.
