18294293. COPPER CLAD LAMINATE AND PRINTED WIRING BOARD simplified abstract (Sony Group Corporation)
Contents
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
Organization Name
Inventor(s)
Fumikatsu Uesawa of Tokyo (JP)
Yoshiyuki Nomura of Tokyo (JP)
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18294293 titled 'COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
The present technology relates to a copper clad laminate with a resin substrate that is biodegradable and less prone to warping or cracking.
- Resin substrate containing at least 50% polylactic acid
- Degree of crystallization of the polylactic acid between 29% and 36%
- Crystallite size of the polylactic acid between 19 nm and 26 nm
- Adhesive layer and copper foil layer stacked on the resin substrate
- Printed wiring board formed using the copper clad laminate
Potential Applications: - Electronics manufacturing - Sustainable packaging materials - Biodegradable products
Problems Solved: - Environmental impact of traditional copper clad laminates - Warping and cracking issues in resin substrates
Benefits: - Reduced environmental footprint - Enhanced durability and stability - Versatile applications in various industries
Commercial Applications: Title: Sustainable Copper Clad Laminates for Electronics Manufacturing This technology can be used in the production of printed circuit boards, electronic components, and packaging materials in industries focused on sustainability and eco-friendly practices.
Questions about Copper Clad Laminates: 1. How does the use of polylactic acid in the resin substrate contribute to the biodegradability of the copper clad laminate? - Polylactic acid is a biodegradable polymer derived from renewable resources, making the laminate environmentally friendly.
2. What are the advantages of using a copper clad laminate with a biodegradable resin substrate in electronics manufacturing? - The use of biodegradable materials reduces the environmental impact of electronic waste and promotes sustainability in the industry.
Original Abstract Submitted
An object of the present technology is to provide a copper clad laminate including a resin substrate that has biodegradability and less likely to warp or crack. The present technology provides a copper clad laminate including: a resin substrate; an adhesive layer; and a copper foil layer, the adhesive layer and the copper foil layer being stacked in this order on at least one side of the resin substrate, the resin substrate containing at least 50 mass % or more of polylactic acid, the degree of crystallization of the polylactic acid calculated on a basis of a result of differential scanning calorimetry being 29% or more and 36% or less, a crystallite size of the polylactic acid calculated on a basis of a result of X-ray diffraction measurement being 19 nm or more and 26 nm or less. Further, the present technology provides a printed wiring board formed using the copper clad laminate.
