18288807. COIL DEVICE simplified abstract (Sumitomo Electric Industries, Ltd.)
Contents
COIL DEVICE
Organization Name
Sumitomo Electric Industries, Ltd.
Inventor(s)
COIL DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18288807 titled 'COIL DEVICE
The coil device described in the patent application consists of a base film with two principal surfaces, each hosting a coil wiring line with a spirally wound portion, covered by protective layers, and an electrically conductive section. A through hole is formed in the base film, extending along the thickness direction.
- The coil device includes a base film with two principal surfaces.
- Each principal surface has a coil wiring line with a spirally wound portion.
- Protective layers cover the coil wiring lines.
- An electrically conductive section is present.
- A through hole is formed in the base film along the thickness direction.
Potential Applications: - This technology could be used in the manufacturing of compact electronic devices. - It may find applications in wireless charging systems. - It could be utilized in RFID technology for data transmission.
Problems Solved: - Provides a compact and efficient way to incorporate coils in electronic devices. - Enhances the durability and protection of coil wiring lines. - Facilitates the integration of coils in various electronic applications.
Benefits: - Improved performance and reliability of electronic devices. - Cost-effective manufacturing process. - Enhanced functionality in wireless charging and data transmission systems.
Commercial Applications: Title: Innovative Coil Device for Electronic Applications This technology can be applied in the production of smartphones, smartwatches, and other portable electronic devices. It can also be integrated into wireless charging pads and RFID systems, catering to the growing demand for compact and efficient electronic components in the market.
Questions about Coil Device Technology: 1. How does the through hole in the base film contribute to the functionality of the coil device? 2. What are the specific advantages of having protective layers covering the coil wiring lines in electronic devices?
Original Abstract Submitted
A coil device includes a base film that has a first principal surface and a second principal surface; a first coil wiring line that is disposed on the first principal surface and has a spirally wound portion; a second coil wiring line that is disposed on the second principal surface and has a spirally wound portion; a first protective layer that is disposed on the first principal surface to cover the first coil wiring line; a second protective layer that is disposed on the second principal surface to cover the second coil wiring line; and an electrically conductive section. A through hole is formed in the base film. The through hole extends through the base film along a thickness direction.
