18281910. DEVICE MODULE simplified abstract (AUTONETWORKS TECHNOLOGIES, LTD.)
Contents
DEVICE MODULE
Organization Name
AUTONETWORKS TECHNOLOGIES, LTD.
Inventor(s)
Yasuyuki Yamamoto of Osaka (JP)
Takuya Taniguchi of Osaka (JP)
DEVICE MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18281910 titled 'DEVICE MODULE
The patent application aims to provide a technique for cooling a device without the need for it to be housed inside a duct.
- A device module consists of a support member located in the roof inner space of a vehicle, between the roof panel and an interior member.
- The device is supported by a support surface on the outer surfaces of the support member.
- A flow path is formed inside the support member, connecting to a duct-side flow path in the vehicle.
Potential Applications: - Automotive industry for cooling electronic devices in vehicles - Aerospace industry for cooling systems in aircraft
Problems Solved: - Eliminates the need for a duct to cool devices - Provides a more efficient cooling system for devices in vehicles
Benefits: - Improved cooling efficiency - Space-saving design - Enhanced device performance and longevity
Commercial Applications: Title: Innovative Cooling System for Vehicles This technology can be used in various vehicles to improve cooling systems for electronic devices, enhancing overall performance and reliability. The market implications include increased demand for more efficient cooling solutions in the automotive and aerospace industries.
Prior Art: Readers can start searching for prior art related to this technology in patents related to vehicle cooling systems, electronic device cooling methods, and innovative support structures for devices.
Frequently Updated Research: Stay updated on advancements in vehicle cooling systems, electronic device cooling technologies, and innovative support structures for devices to enhance the understanding and application of this technology.
Questions about the Innovative Cooling System: 1. How does this technology improve cooling efficiency in vehicles? - This technology enhances cooling efficiency by providing a more direct and effective cooling system for devices without the need for a duct.
2. What are the potential applications of this cooling system outside of the automotive industry? - This cooling system can also be applied in the aerospace industry for cooling systems in aircraft, providing a versatile solution for various industries.
Original Abstract Submitted
One aim is to provide a technique allowing a device to be cooled without being housed inside a duct. A device module includes: a support member that is disposed in a roof inner space that is located between a roof panel and an interior member in a vehicle; and a device that is supported by a support surface among outer surfaces of the support member. A support-member-side flow path is formed inside the support member, and the support-member-side flow path is connected to a duct-side flow path in a duct in the vehicle.
