18275312. SEMICONDUCTOR PACKAGE simplified abstract (LG INNOTEK CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18275312 titled 'SEMICONDUCTOR PACKAGE
The circuit board described in the abstract consists of an insulating layer, a first metal layer passing through the insulating layer, and a second metal layer on top of the first metal layer. The first metal layer has a concave upper surface and a lower surface, while the second metal layer has a convex lower surface that matches the concave upper surface of the first metal layer.
- The first metal layer has a smaller height between the convex lower surface of the second metal layer and the insulating layer compared to the height between the upper surface of the insulating layer and the lower surface of the insulating layer.
- The design of the circuit board allows for a unique configuration that optimizes the space and functionality of the layers.
- This innovation could potentially improve the efficiency and performance of electronic devices that use circuit boards.
- The specific configuration of the metal layers addresses issues related to space constraints and signal transmission in electronic devices.
- By optimizing the layout of the metal layers, this technology offers benefits such as improved signal integrity and reduced interference.
Potential Applications: - Consumer electronics - Telecommunications equipment - Automotive electronics
Problems Solved: - Space constraints in circuit board design - Signal transmission efficiency - Interference reduction
Benefits: - Improved signal integrity - Enhanced performance of electronic devices - Space optimization in circuit board design
Commercial Applications: Title: Advanced Circuit Board Design for Enhanced Electronic Performance This technology could be utilized in various industries such as consumer electronics, telecommunications, and automotive sectors to improve the efficiency and performance of electronic devices.
Questions about the technology: 1. How does the unique configuration of the metal layers contribute to the overall performance of the circuit board? 2. What specific advantages does the concave-convex design offer in terms of signal transmission and interference reduction?
Original Abstract Submitted
A circuit board according to an embodiment includes an insulating layer; a first metal layer passing through upper and lower surfaces of the insulating layer; and a second metal layer disposed on the first metal layer; wherein the first metal layer includes a concave upper surface and a lower surface, wherein the second metal layer includes a convex lower surface corresponding to the concave upper surface of the first metal layer, and wherein a first height between the convex lower surface of the second metal layer and the lower surface of the insulating layer is smaller than a second height between the upper surface of the insulating layer and the lower surface of the insulating layer.
