18263621. CIRCUIT BOARD simplified abstract (LG INNOTEK CO., LTD.)
Contents
CIRCUIT BOARD
Organization Name
Inventor(s)
CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18263621 titled 'CIRCUIT BOARD
The circuit board described in the abstract includes an insulating layer with two regions, a circuit pattern on the upper surface of both regions, and a solder resist with varying heights on each region.
- The solder resist on the first region has a smaller height than the circuit pattern, while the solder resist on the second region has a greater height than the circuit pattern.
- The regions may be divided into partial regions, with the solder resist having different heights in each partial region.
This innovation allows for precise control of solder resist heights, which can improve the performance and reliability of the circuit board.
Potential Applications: - Electronics manufacturing - Printed circuit board assembly
Problems Solved: - Ensuring proper solder resist heights for different regions of a circuit board - Enhancing the overall quality and functionality of circuit boards
Benefits: - Improved soldering processes - Enhanced durability and reliability of circuit boards
Commercial Applications: Title: Advanced Circuit Board Technology for Enhanced Performance This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, and telecommunications for more efficient and reliable electronic devices.
Questions about the technology: 1. How does the varying height of the solder resist impact the performance of the circuit board? - The varying height of the solder resist allows for better control of soldering processes and can improve the overall reliability of the circuit board.
2. What are the specific advantages of using this innovative circuit board design? - The innovative design allows for more precise control over solder resist heights, leading to improved performance and reliability of electronic devices.
Original Abstract Submitted
A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.
