18243080. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Rie Arima of Komatsu Ishikawa (JP)
Kazuki Matsuo of Nonoichi Ishikawa (JP)
Masaru Izumisawa of Kanazawa Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18243080 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the patent application includes a metal base, a terminal, a semiconductor chip with electrodes, a connection member, and a conductive member.
- Metal base
- Terminal
- Semiconductor chip with electrodes
- Connection member
- Conductive member
Key Features and Innovation: The innovation lies in the design of the semiconductor device, where the connection member and conductive member facilitate the connection between the semiconductor chip and the terminal.
Potential Applications: This technology could be used in various electronic devices that require efficient semiconductor components.
Problems Solved: This technology addresses the need for a reliable and efficient connection between the semiconductor chip and the terminal in a semiconductor device.
Benefits: The benefits of this technology include improved performance, reliability, and longevity of semiconductor devices.
Commercial Applications: This technology could have commercial applications in the electronics industry, particularly in the manufacturing of consumer electronics, telecommunications equipment, and industrial machinery.
Questions about Semiconductor Devices: 1. How does the design of the semiconductor device impact its overall performance? 2. What are the potential challenges in implementing this technology in mass-produced electronic devices?
Frequently Updated Research: Researchers are constantly exploring new materials and designs to enhance the efficiency and performance of semiconductor devices. Stay updated on the latest advancements in this field for potential future applications.
Original Abstract Submitted
According to one embodiment, a semiconductor device includes a metal base, a terminal separated from the metal base, a semiconductor chip including a back-surface-side electrode connected to the metal base and a front-surface-side electrode provided on a front surface opposite to the back-surface-side electrode, a connection member including a first end portion connected to the front-surface-side electrode of the semiconductor chip and a second end portion connected to the terminal, and a conductive member provided on the front-surface-side electrode of the semiconductor chip and covering a region of the front-surface-side electrode that is not connected to the first end portion of the connection member.
