18241531. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Bong Ken Yu of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18241531 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The semiconductor package described in the abstract aims to prevent warpage of an interposer to enhance product reliability. Here are some key points to explain the innovation:

• The semiconductor package includes a first substrate with a first insulating layer and a first conductive pattern, a semiconductor chip on the first substrate, and an interposer with a second insulating layer and a second conductive pattern.
• The interposer also features a support member on its bottom surface, in contact with the upper surface of the semiconductor chip, comprising a first lower pad, a bump under the first lower pad, and a first connection member connecting the first and second conductive patterns.

1. 1. 1. Potential Applications

- This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics. - It can also be used in industrial applications where reliable semiconductor packages are required for high-performance computing systems.

1. 1. 1. Problems Solved

- Prevents warpage of the interposer, which can lead to electrical connection issues and reduce product reliability. - Ensures stable and secure connections between the semiconductor chip and the interposer, improving overall performance and longevity of the semiconductor package.

1. 1. 1. Benefits

- Enhanced product reliability due to the prevention of interposer warpage. - Improved electrical connections between components, leading to better performance and durability of the semiconductor package.

1. 1. 1. Potential Commercial Applications
         1. Enhancing Product Reliability with Semiconductor Packages

- This section title is optimized for SEO to attract readers interested in improving product reliability with semiconductor packages.

1. 1. 1. Possible Prior Art

There may be prior art related to semiconductor package designs aimed at preventing warpage of interposers, but specific examples are not provided in this abstract.

1. 1. 1. 1. Unanswered Questions
         2. How does the support member prevent warpage of the interposer?

The support member, including the first lower pad, bump, and first connection member, likely helps distribute stress and maintain structural integrity, preventing warpage of the interposer.

1. 1. 1. 1. What materials are used in the support member for optimal performance?

The materials used in the support member, such as the first lower pad, bump, and first connection member, are crucial for ensuring effective prevention of warpage and maintaining reliable connections within the semiconductor package.

Original Abstract Submitted

There is provided a semiconductor package in which warpage of an interposer is prevented to improve product reliability. The semiconductor package comprising a first substrate including a first insulating layer, and a first conductive pattern disposed in the first insulating layer, a semiconductor chip disposed on the first substrate, an interposer disposed on the semiconductor chip, wherein the interposer includes a second insulating layer, and a second conductive pattern disposed in the second insulating layer, a support member disposed on a bottom surface of the second insulating layer and is in contact with an upper surface of the semiconductor chip, wherein the support member includes a first lower pad and a bump disposed under the first lower pad and a first connection member disposed between the first substrate and the interposer so as to connect the first conductive pattern and the second conductive pattern to each other.