18228376. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Jong Min Baek of Suwon-si (KR)
Moon Kyun Song of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18228376 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes an interlayer insulating film with a source/drain pattern, a channel pattern, front and back wirings, and connecting via contacts.
- The device features an interlayer insulating film with distinct surfaces and patterns for efficient electrical connections.
- The source/drain pattern and channel pattern are strategically positioned for optimal functionality.
- Front and back wirings facilitate the flow of electrical signals within the device.
- Connecting via contacts ensure proper connections between different components of the device.
- Overall, the device is designed to enhance the performance and reliability of semiconductor technology.
Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices. - It can be used in various electronic devices such as smartphones, computers, and tablets.
Problems Solved: - Provides improved electrical connectivity and efficiency in semiconductor devices. - Enhances the overall performance and reliability of electronic devices.
Benefits: - Increased functionality and performance of semiconductor devices. - Improved electrical connections leading to better device reliability. - Enhanced overall user experience with electronic devices.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, catering to a wide range of industries such as consumer electronics, telecommunications, and computing.
Questions about Semiconductor Device Technology: 1. How does the interlayer insulating film contribute to the efficiency of the semiconductor device? - The interlayer insulating film provides insulation between different components of the device, preventing electrical interference and ensuring proper functionality. 2. What are the key advantages of using connecting via contacts in semiconductor devices? - Connecting via contacts enable secure and reliable connections between different parts of the device, enhancing overall performance and functionality.
Original Abstract Submitted
A semiconductor device includes an interlayer insulating film including a first surface and a second surface opposite to the first surface in a first direction; a source/drain pattern provided in the interlayer insulating film; a channel pattern adjacent to the source/drain pattern in a second direction and contacting the source/drain pattern; a front wiring provided on the first surface of the interlayer insulating film; a back wiring provided on the second surface of the interlayer insulating film; and a first connecting via contact and a second connecting via contact which are provided between the source/drain pattern and the back wiring and connected to the source/drain pattern.
