18207475. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18207475 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a base chip, a semiconductor chip, a bump, and an adhesive film. The base chip has a substrate, an upper protective layer, an upper pad, and a groove. The semiconductor chip has a connection pad and is mounted on the base chip. The bump electrically connects the base chip and the semiconductor chip. The adhesive film fixes the semiconductor chip on the base chip and fills the groove.
- The semiconductor package includes a base chip with a protective layer and a groove, a semiconductor chip with a connection pad, a bump for electrical connection, and an adhesive film for fixing the semiconductor chip.
- The base chip has a substrate and an upper protective layer, with an upper pad and a recessed groove adjacent to it.
- The semiconductor chip is mounted on the base chip and has a connection pad that is placed on the upper pad.
- The bump is used to electrically connect the base chip and the semiconductor chip.
- The adhesive film is placed between the base chip and the semiconductor chip to fix the semiconductor chip on the base chip and fill the groove.
Potential Applications
- This semiconductor package can be used in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
- It can be applied in automotive electronics, aerospace systems, and industrial equipment where reliable and compact semiconductor packaging is required.
Problems Solved
- The semiconductor package solves the problem of securely mounting a semiconductor chip on a base chip.
- The groove in the base chip allows for the adhesive film to fill the recess, providing better adhesion and stability.
- The bump provides a reliable electrical connection between the base chip and the semiconductor chip.
Benefits
- The use of an adhesive film and bump ensures a strong and reliable connection between the base chip and the semiconductor chip.
- The recessed groove in the base chip allows for better filling of the adhesive film, enhancing the overall stability of the package.
- The semiconductor package provides a compact and efficient solution for integrating and connecting semiconductor chips in electronic devices.
Original Abstract Submitted
A semiconductor package includes: a base chip including a substrate, an upper protective layer disposed on the substrate, an upper pad disposed on the upper protective layer, and a groove disposed adjacent to the upper pad and in which the upper protective layer is recessed; a semiconductor chip including a connection pad disposed on the upper pad, the semiconductor chip being mounted on the base chip; a bump disposed on the upper pad, and electrically connecting the base chip and the semiconductor chip; and an adhesive film disposed between the base chip and the semiconductor chip, and fixing the semiconductor chip on the base chip, wherein the adhesive film is configured to fill the groove.
