18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation)

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE

Organization Name

Intel Corporation

Inventor(s)

Kyle Arrington of Gilbert AZ (US)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18182879 titled 'METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE

Simplified Explanation

The patent application discusses methods to improve the reliability of vias in a glass substrate of an integrated circuit package by using a conductive material containing gallium and silver.

• Glass substrate of an integrated circuit package
• Via with conductive material containing gallium and silver

Key Features and Innovation

• Use of gallium and silver in the conductive material for vias
• Improved reliability of vias in a glass substrate of an integrated circuit package

Potential Applications

The technology can be applied in the manufacturing of integrated circuit packages to enhance the reliability of vias in glass substrates.

Problems Solved

• Enhances the reliability of vias in glass substrates of integrated circuit packages
• Addresses potential issues related to the conductivity and durability of vias

Benefits

• Increased reliability of vias in glass substrates
• Improved performance and longevity of integrated circuit packages

Commercial Applications

Glass Substrate Manufacturing

This technology can be utilized in the production of integrated circuit packages with glass substrates, ensuring better reliability and performance.

Prior Art

There may be prior research on the use of different materials in vias to improve reliability in integrated circuit packages. Researchers can explore databases and academic journals for relevant information.

Frequently Updated Research

Researchers may be conducting studies on the effectiveness of different materials in enhancing the reliability of vias in integrated circuit packages. Stay updated on the latest advancements in this field.

Questions about Glass Substrate Vias

What are the key materials used to improve the reliability of vias in glass substrates of integrated circuit packages?

The key materials used are gallium and silver in the conductive material of the vias.

How does the use of gallium and silver in vias benefit the reliability of integrated circuit packages?

The use of gallium and silver enhances the conductivity and durability of the vias, leading to improved reliability in integrated circuit packages.

Original Abstract Submitted

Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit package are disclosed. An example integrated circuit (IC) package substrate includes a glass substrate, a via extending between first and second surfaces of the glass substrate, and a conductive material provided in the via, the conductive material including gallium and silver.