18173767. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)

ISOLATOR

Organization Name

KABUSHIKI KAISHA TOSHIBA

Inventor(s)

Yoshinari Tamura of Yokohama Kanagawa (JP)

Yusuke Imaizumi of Kawasaki Kanagawa (JP)

Jia Liu of Yokohama Kanagawa (JP)

Daijo Chida of Yokohama Kanagawa (JP)

Minoru Takizawa of Sagamihara Kanagawa (JP)

ISOLATOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 18173767 titled 'ISOLATOR

Simplified Explanation

The patent application describes an isolator with multiple semiconductor chips and coils separated by wiring boards and an insulator.

• The isolator includes:
  • First semiconductor chip
  • Second semiconductor chip
  • First wiring board with first chip
  • Second wiring board with second chip
  • Third wiring board spaced apart from first two
  • Coils on surfaces of boards facing each other
  • Insulator between coils

Potential Applications

The technology could be used in:

• Power electronics
• Communication systems
• Industrial automation

Problems Solved

This technology helps in:

• Isolating signals
• Preventing interference
• Enhancing safety in electronic systems

Benefits

The benefits of this technology include:

• Improved signal quality
• Increased reliability
• Enhanced performance of electronic devices

Potential Commercial Applications

A potential commercial application could be:

• Isolation components for electronic devices

Possible Prior Art

There may be prior art related to:

• Isolation techniques in electronic circuits
• Coil arrangements in semiconductor devices

Unanswered Questions

How does this technology compare to traditional isolators?

This article does not provide a direct comparison to traditional isolators, leaving the reader to wonder about the advantages and disadvantages of this new technology.

What are the specific industries that could benefit most from this technology?

The article mentions potential applications in power electronics and communication systems, but does not delve into specific industries that could see the most significant impact.

Original Abstract Submitted

According to one embodiment, an isolator includes: a first semiconductor chip; a second semiconductor chip; a first wiring board including a first surface provided thereon with the first semiconductor chip; a second wiring board including a second surface provided thereon with the second semiconductor chip, the second wiring board being spaced apart from the first wiring board; a third wiring board spaced apart from each of the first and second wiring boards; a first coil on the first surface; a second coil on the second surface; a third coil on a third surface of the third wiring board, the third surface facing the first and second surfaces, the third coil facing the first coil; a fourth coil on the third surface, facing the second coil, and electrically coupled to the third coil; and an insulator provided between the first to fourth coils.