18170851. RESISTIVELY LOADED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE simplified abstract (BAE Systems Information and Electronic Systems Integration Inc.)
Contents
RESISTIVELY LOADED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE
Organization Name
BAE Systems Information and Electronic Systems Integration Inc.
Inventor(s)
Alexander D. Johnson of Waltham MA (US)
RESISTIVELY LOADED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18170851 titled 'RESISTIVELY LOADED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE
The antenna assembly described in the patent application includes an antenna feed, a ground plane, an antenna element with conductive dipole arms, a conductive wall (H-wall), and a resistive surface.
- The antenna feed is designed to receive signals over a wide bandwidth.
- The antenna element consists of first and second conductive dipole arms aligned with the ground plane and adjacent to each other.
- The H-wall is in electrical communication with the ground plane and physically separated from the second conductive dipole arm.
- The resistive surface has an attenuation effect on reflected signals from the ground plane.
Potential Applications: - Communication systems - Radar systems - Satellite communication - Wireless networks
Problems Solved: - Improved signal reception over a wide bandwidth - Reduced signal interference - Enhanced antenna performance
Benefits: - Increased signal clarity - Better signal reception in various frequencies - Enhanced overall system performance
Commercial Applications: Title: "Advanced Antenna Assembly for Enhanced Signal Reception" This technology can be utilized in various commercial applications such as telecommunications, aerospace, defense, and IoT industries. It can improve signal transmission and reception in a wide range of devices and systems, leading to better communication and data transfer capabilities.
Prior Art: Readers can explore prior art related to antenna assemblies, ground plane designs, and signal attenuation techniques in the field of telecommunications and antenna technology.
Frequently Updated Research: Researchers are continuously exploring new materials and designs to enhance antenna performance and signal reception. Stay updated on the latest advancements in antenna technology to improve communication systems and networks.
Questions about Antenna Assembly Technology: 1. How does the conductive wall (H-wall) contribute to signal reception in the antenna assembly? - The H-wall enhances signal reception by providing electrical communication with the ground plane and reducing interference from reflected signals.
2. What are the potential challenges in implementing this antenna assembly technology in different communication systems? - Some challenges may include integration with existing systems, optimizing performance for specific frequencies, and ensuring compatibility with various devices and networks.
Original Abstract Submitted
An antenna assembly includes an antenna feed configured to receive a signal over a wide bandwidth, a ground plane, and an antenna element. The antenna element includes first and second conductive dipole arms each in planar alignment with a surface of the ground plane and adjacent to each other. The antenna assembly further includes a conductive wall (“H-wall”) in electrical communication with the ground plane and having an end adjacent to, and physically separate from, the second conductive dipole arm, where an axial length of the H-wall being orthogonal to the ground plane, and a resistive surface having an attenuation effect on the reflected signal from the ground plane.
