18165772. Thermal Dissipation Structures and Methods for Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Thermal Dissipation Structures and Methods for Forming Same
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Liang-Wei Wang of Hsinchu City (TW)
Tsung-Chieh Hsiao of Changhua County (TW)
Thermal Dissipation Structures and Methods for Forming Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 18165772 titled 'Thermal Dissipation Structures and Methods for Forming Same
The abstract describes an integrated semiconductor device with a first semiconductor structure containing a first IC and a second semiconductor structure stacked above it with a second IC. A thermal dissipation structure is included, partially passing through the first IC and fully through the second semiconductor structure, exposed at the second surface of the second semiconductor structure.
- The integrated semiconductor device includes two semiconductor structures with different ICs.
- A thermal dissipation structure is integrated into the device to manage heat.
- The thermal dissipation structure passes through the first IC and the second semiconductor structure.
- The second portion of the thermal dissipation structure is exposed at the second surface of the second semiconductor structure.
- The second portion of the thermal dissipation structure is outside of the second IC.
Potential Applications: - This technology can be used in high-performance computing devices. - It can be applied in data centers to improve thermal management. - Mobile devices can benefit from the enhanced heat dissipation capabilities.
Problems Solved: - Improved thermal management in semiconductor devices. - Enhanced performance and reliability of integrated circuits. - Prevention of overheating issues in electronic devices.
Benefits: - Increased efficiency and longevity of semiconductor devices. - Better performance under heavy workloads. - Reduced risk of damage due to overheating.
Commercial Applications: Title: Enhanced Thermal Management Technology for Semiconductor Devices This technology can be utilized in the manufacturing of smartphones, laptops, servers, and other electronic devices to improve heat dissipation and overall performance. It can also be integrated into automotive electronics and industrial equipment for enhanced reliability.
Questions about Integrated Semiconductor Device Thermal Dissipation Technology: 1. How does the thermal dissipation structure improve the performance of the integrated semiconductor device? 2. What are the potential long-term benefits of integrating this thermal dissipation technology into electronic devices?
Original Abstract Submitted
An integrated semiconductor device is provided. The integrated semiconductor device includes a first semiconductor structure having a first IC, and a second semiconductor structure stacked above the first semiconductor structure and having a second IC. The second semiconductor structure has a first surface facing the first semiconductor structure and a second surface facing away from the first semiconductor structure. The integrated semiconductor device also includes a thermal dissipation structure having a first portion partially through the first IC and a second portion fully through the second semiconductor structure and exposed at the second surface of the second semiconductor structure. The second portion may be outside of the second IC.
