18148160. DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
Contents
DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME
Organization Name
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Inventor(s)
Oliver Zhao of Sunnyvale CA (US)
Bongsub Lee of Santa Clara CA (US)
Cyprian Emeka Uzoh of San Jose CA (US)
DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18148160 titled 'DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME
The abstract of the patent application describes an element, bonded structure, and methods for forming the structure. The bonded structure includes a first element with a nonconductive field region and a conductive feature, and a second element with a nonconductive field region and a conductive feature. The two elements are directly hybrid bonded to each other, with their nonconductive field regions and conductive features directly bonded along a bond interface.
- The bonded structure consists of two elements with nonconductive field regions and conductive features.
- The first element is directly hybrid bonded to the second element.
- The first and second nonconductive field regions are bonded to each other along a bond interface.
- The first and second conductive features are also directly bonded to each other.
- The first conductive feature may include a perforated oxide layer, with a percentage of aluminum oxide present.
Potential Applications: - This technology could be used in semiconductor manufacturing for creating advanced electronic devices. - It may find applications in aerospace for developing lightweight and durable materials. - The bonded structure could be utilized in medical devices for improved performance and reliability.
Problems Solved: - Enhances the bonding strength between different elements in a structure. - Provides a method for directly hybrid bonding nonconductive and conductive regions. - Improves the overall performance and durability of the bonded structure.
Benefits: - Increased reliability and stability of the bonded structure. - Enhanced electrical conductivity between elements. - Potential for creating complex structures with improved properties.
Commercial Applications: Title: Advanced Bonded Structures for Semiconductor Manufacturing This technology could revolutionize the semiconductor industry by enabling the creation of more efficient and reliable electronic devices. It could also have significant implications in aerospace and medical device manufacturing, leading to the development of innovative products with enhanced performance.
Questions about Advanced Bonded Structures for Semiconductor Manufacturing: 1. How does this technology improve the bonding strength between different elements in a structure? 2. What are the potential applications of this technology in the aerospace industry?
Original Abstract Submitted
An element, bonded structure that includes the element, and methods forming the same are disclosed. A bonded structure can include a first element having a first nonconductive field region and a first conductive feature, and a second element having a second nonconductive field region and a second conductive feature. The second element is directly hybrid bonded to the first element such that the first and second nonconductive field regions are directly bonded to one another along a bond interface and the first and second conductive features are directly bonded to one another. The first conductive feature can include a perforated oxide layer. at. % to at. % of the first aluminum feature can be aluminum oxide.
