18141265. STRUCTURE AND METHOD FOR BONDED WAFER BARRIER simplified abstract (Texas Instruments Incorporated)
Contents
STRUCTURE AND METHOD FOR BONDED WAFER BARRIER
Organization Name
Texas Instruments Incorporated
Inventor(s)
John C. Ehmke of Longview TX (US)
Jennifer Lynne Holm of Dallas TX (US)
STRUCTURE AND METHOD FOR BONDED WAFER BARRIER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18141265 titled 'STRUCTURE AND METHOD FOR BONDED WAFER BARRIER
The abstract describes an example apparatus that includes a semiconductor device layer with a bond pad area, a bond pad on the semiconductor device layer in the bond pad area, a scribe seal surrounding the bond pad on at least three sides, and a swarf barrier on the scribe seal.
- The apparatus includes a semiconductor device layer with a bond pad area.
- A bond pad is located on the semiconductor device layer within the bond pad area.
- A scribe seal surrounds the bond pad on at least three sides to provide protection.
- A swarf barrier is placed on the scribe seal, with two portions at different distances from the semiconductor device layer.
Potential Applications: - This technology could be used in the manufacturing of semiconductor devices to protect bond pads. - It can be applied in the electronics industry to enhance the reliability of electronic components.
Problems Solved: - Provides protection to bond pads from external elements such as swarf. - Ensures the longevity and reliability of semiconductor devices.
Benefits: - Increased durability and reliability of semiconductor devices. - Enhanced protection for bond pads during manufacturing and use.
Commercial Applications: Title: Enhanced Protection Technology for Semiconductor Devices This technology can be utilized in the semiconductor industry to improve the quality and reliability of electronic components. It can also be integrated into various electronic devices to enhance their performance and longevity.
Questions about the technology: 1. How does the swarf barrier contribute to the protection of the bond pad? - The swarf barrier acts as a shield against external elements that could potentially damage the bond pad, ensuring its integrity and functionality. 2. What are the advantages of having a scribe seal surrounding the bond pad? - The scribe seal provides additional protection to the bond pad, reducing the risk of damage and increasing the overall reliability of the semiconductor device.
Original Abstract Submitted
An example apparatus includes a semiconductor device layer including a bond pad area, a bond pad on the semiconductor device layer in the bond pad area; a scribe seal on the semiconductor device layer, the scribe seal surrounding the bond pad on at least three sides; and a swarf barrier on the scribe seal, the swarf barrier including: a first portion a first distance from the semiconductor device layer; and a second portion a second distance from the semiconductor device layer, the second distance being larger than the first distance.
