18134933. POWER MODULE simplified abstract (Hyundai Motor Company)
Contents
- 1 POWER MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
POWER MODULE
Organization Name
Inventor(s)
Jin Myeong Yang of Seongnam-Si (KR)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18134933 titled 'POWER MODULE
Simplified Explanation
The abstract describes a power module with various components such as substrates, semiconductor chips, spacers, connection layers, and power leads.
- Upper and lower substrates are part of the power module.
- Spacers are used to connect different layers and components electrically.
- Connection layers allow for penetration of spacers.
- Power lead is included in the power module.
Potential Applications
The technology described in this patent application could be applied in various power electronics systems, such as inverters, converters, motor drives, and power supplies.
Problems Solved
This technology solves the problem of efficiently connecting different components in a power module while maintaining electrical conductivity and reliability.
Benefits
The benefits of this technology include improved performance, increased efficiency, enhanced reliability, and potentially reduced size and cost of power modules.
Potential Commercial Applications
The technology could be commercialized in industries such as automotive, renewable energy, industrial automation, and consumer electronics under the title "Innovative Power Module Technology for Enhanced Performance".
Possible Prior Art
One possible prior art in this field is the use of traditional wire bonding or soldering techniques to connect components in power modules. However, the technology described in this patent application offers a more efficient and reliable solution.
Unanswered Questions
How does this technology compare to existing power module designs in terms of cost-effectiveness?
The article does not provide specific information on the cost-effectiveness of this technology compared to existing designs.
What are the environmental implications of using this technology in power electronics systems?
The article does not address the environmental impact or sustainability aspects of implementing this technology in power electronics systems.
Original Abstract Submitted
A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed between the upper substrate and the lower substrate, and configured to allow the first spacer and the second spacer to penetrate the first connection layer, and a power lead.
