18112616. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
HSIH-YANG Chiu of TAOYUAN CITY (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18112616 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The semiconductor device described in the patent application includes an interposer, a conductive via, an insulation layer, and a first electronic component. The interposer has a first surface and a second surface, with the conductive via extending between them. The insulation layer separates the conductive via from the interposer, and the first electronic component is placed on the second surface and connected to the conductive via.
- The semiconductor device features an interposer with conductive vias for electrical connections.
- An insulation layer separates the conductive vias from the interposer to prevent interference.
- The first electronic component is mounted on the interposer and connected to the conductive vias for functionality.
- This design allows for efficient and reliable electrical connections within the semiconductor device.
- The method of manufacturing involves precise assembly of the interposer, conductive vias, insulation layer, and electronic components.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a solution for creating compact and efficient electrical connections in semiconductor devices. - Ensures reliable performance and functionality of electronic components.
Benefits: - Improved electrical connectivity and signal transmission. - Enhanced overall performance and reliability of electronic devices. - Cost-effective manufacturing process for semiconductor devices.
Commercial Applications: Title: Advanced Semiconductor Device with Interposer and Conductive Vias This technology has commercial applications in the consumer electronics industry, automotive sector, medical device manufacturing, and industrial automation.
Questions about the technology: 1. How does the insulation layer contribute to the functionality of the semiconductor device? 2. What are the advantages of using an interposer with conductive vias in electronic components?
Original Abstract Submitted
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes an interposer, a conductive via, an insulation layer, and a first electronic component. The interposer has a first surface and a second surface opposite to the first surface. The conductive via extends between the first surface and the second surface of the interposer. The insulation layer separates the conductive via from the interposer. The first electronic component is disposed on the second surface and electrically connected to the conductive via.
