18098827. PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
Contents
PACKAGE STRUCTURE
Organization Name
Advanced Semiconductor Engineering, Inc.
Inventor(s)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18098827 titled 'PACKAGE STRUCTURE
The present disclosure introduces a package structure with a die bonding region and a first lead region. The first lead region consists of a first high density lead region and a first low density lead region, extending along a first direction.
- The package structure includes a die bonding region and a first lead region.
- The first lead region comprises a first high density lead region and a first low density lead region.
- The first high density lead region overlaps the first low density lead region in the first direction.
Potential Applications: - Semiconductor packaging - Electronics manufacturing
Problems Solved: - Efficient organization of leads in a package structure - Improved connectivity in electronic devices
Benefits: - Enhanced performance of electronic components - Streamlined manufacturing processes
Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive electronics. It can improve the reliability and functionality of these devices, leading to a better user experience.
Questions about Semiconductor Packaging Technology: 1. How does this package structure improve the performance of electronic devices? This package structure enhances connectivity and organization of leads, resulting in improved functionality and reliability of electronic components.
2. What are the potential applications of this technology beyond semiconductor packaging? This technology can also be applied in various industries such as telecommunications, aerospace, and medical devices to enhance the performance and reliability of electronic systems.
Original Abstract Submitted
The present disclosure provides a package structure. The package structure includes a die bonding region and a first lead region. The first lead region extends along a first direction. The first direction is along a first edge of the die bonding region. The first lead region includes a first high density lead region and a first low density lead region. The first high density lead region overlaps the first low density lead region in the first direction.
