17901335. IMAGE SENSOR simplified abstract (Samsung Electronics Co., Ltd.)

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IMAGE SENSOR

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Minho Jang of Suwon-si (KR)

Seungkuk Kang of Seoul (KR)

IMAGE SENSOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 17901335 titled 'IMAGE SENSOR

Simplified Explanation

The abstract describes an image sensor with a stack structure that includes an active pixel region and a pad region. The stack structure consists of multiple substrates and structures, including a photoelectric conversion region, a floating diffusion region, a pixel gate, and a logic transistor.

  • The image sensor has a stack structure with an active pixel region and a pad region.
  • The stack structure includes multiple substrates and structures.
  • Each pixel in the active pixel region has a photoelectric conversion region and a floating diffusion region.
  • The pad region has a pad opening that allows for access to the pad.
  • The pixel gate is electrically connected to the floating diffusion region in each pixel.
  • The logic transistor is included for driving the pixels.

Potential Applications

  • Digital cameras
  • Smartphones
  • Surveillance systems
  • Medical imaging devices

Problems Solved

  • Improved image sensor design
  • Enhanced pixel functionality
  • Efficient data transfer and processing

Benefits

  • Higher quality images
  • Increased pixel sensitivity
  • Improved signal-to-noise ratio
  • Faster data transfer and processing


Original Abstract Submitted

An image sensor includes a stack structure including an active pixel region in which a plurality of pixels are defined, and a pad region arranged on at least one side of the active pixel region. The stack structure includes a first substrate including a photoelectric conversion region and a floating diffusion region in each pixel, a first semiconductor substrate, a first front structure on the first semiconductor substrate, and a pad opening penetrating the first semiconductor substrate in the pad region, a second substrate attached to the first substrate and including a pixel gate electrically connected to the floating diffusion region in each pixel, a third substrate attached to the second substrate and including a logic transistor for driving the plurality of pixels, and a pad having a top surface that is exposed through the pad opening.