17862459. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Eungchang Lee of Hanam-si (KR)
Bangweon Lee of Yongin-si (KR)
Kyung Suk Oh of Seongnam-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17862459 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a substrate and at least one semiconductor chip on the substrate. The substrate has a body layer with a top surface and a bottom surface. There is a first thermal conductive plate on the top surface of the body layer, which is connected to a ground terminal of the semiconductor chip. Additionally, there is a thermal conductive via that penetrates the body layer and is in contact with the first thermal conductive plate.
- The semiconductor package includes a substrate and at least one semiconductor chip.
- The substrate has a body layer with a top surface and a bottom surface.
- A first thermal conductive plate is present on the top surface of the body layer.
- The first thermal conductive plate is connected to a ground terminal of the semiconductor chip.
- A thermal conductive via penetrates the body layer and is in contact with the first thermal conductive plate.
Potential applications of this technology:
- Electronics industry
- Semiconductor manufacturing
- Consumer electronics
- Telecommunications
Problems solved by this technology:
- Heat dissipation in semiconductor packages
- Improved thermal conductivity
- Enhanced performance and reliability of semiconductor chips
Benefits of this technology:
- Efficient heat dissipation
- Improved performance and longevity of semiconductor chips
- Enhanced overall functionality of electronic devices
Original Abstract Submitted
A semiconductor package including a substrate and at least one semiconductor chip on the substrate may be provided. The substrate may include a body layer having a top surface and a bottom surface, a first thermal conductive plate on the top surface of the body layer, the first thermal conductive plate connected to a ground terminal of the semiconductor chip, and a thermal conductive via penetrating the body layer and being in contact with the first thermal conductive plate.
