17689091. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Seonho Lee of Cheonan-si (KR)

Myungsung Kang of Yongin-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17689091 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract describes a semiconductor package that includes multiple stacked semiconductor chips with connection pads and a support structure. Here are the key points:

• The semiconductor package consists of a first semiconductor chip and additional chips stacked on top of it.
• Each of the second semiconductor chips has a front connection pad on its lower surface.
• The first semiconductor chip and the second semiconductor chips have rear connection pads attached to their upper surfaces.
• A chip connection terminal is present between the front and rear connection pads.
• A support structure is placed between the first semiconductor chip and one of the second semiconductor chips, as well as between adjacent second semiconductor chips.
• The support structure is made of metal and has a greater vertical height than the chip connection terminal.
• The support structure is spaced apart from the connection pads and the chip connection terminal.

Potential applications of this technology:

• This semiconductor package design can be used in various electronic devices that require multiple stacked semiconductor chips, such as smartphones, tablets, and computers.
• It can be beneficial in high-performance computing systems, where multiple chips need to be densely packed and interconnected.

Problems solved by this technology:

• The support structure helps in providing mechanical stability and structural integrity to the stacked semiconductor chips.
• It prevents any potential damage or misalignment of the chips during handling, transportation, or operation.

Benefits of this technology:

• The use of a support structure ensures reliable and secure stacking of the semiconductor chips, reducing the risk of failure or malfunction.
• The design allows for efficient heat dissipation, as the support structure provides additional space between the chips for improved airflow.
• The vertical height difference between the support structure and the chip connection terminal helps in avoiding any interference or short-circuits between the components.

Original Abstract Submitted

A semiconductor package including a first semiconductor chip; second semiconductor chips sequentially stacked on the first semiconductor chip; a front connection pad on a lower surface of each of the second semiconductor chips; a rear connection pad attached to an upper surface of each of the first semiconductor chip and the second semiconductor chips; a chip connection terminal between the front connection pad and the rear connection pad; and a support structure between the first semiconductor chip and one of the second semiconductor chips and between adjacent ones of the second semiconductor chips, the support structure being spaced apart from the front connection pad, the rear connection pad, and the chip connection terminal, having a vertical height greater than a vertical height of the chip connection terminal, and including a metal.