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• AgTech patent applications on March 21st, 2024
  IPC Code(s): G01W1/14, G06N20/20 [[Category:G01W1/14]][[Category:G06N20/20]][[Category:Henan University]]
  3 KB (404 words) - 09:14, 21 March 2024
• AgTech patent applications on 22nd Mar 2024
  IPC Code(s): G01W1/14, G06N20/20 [[Category:G01W1/14]][[Category:G06N20/20]][[Category:Henan University]]
  3 KB (404 words) - 10:49, 25 March 2024
• 17706100. SPATIAL LIGHT MODULATORS, METHODS OF DRIVING AND MANUFACTURING THE SAME, AND APPARATUSES INCLUDING THE SPATIAL LIGHT MODULATORS simplified abstract (Samsung Electronics Co., Ltd.)
  [[Category:H01S5/125]] [[Category:H01S5/14]]
  4 KB (520 words) - 19:05, 2 January 2024
• 18259145. Semiconductor Laser and Design Method Therefor simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
  [[Category:H01S5/14]] [[Category:H01S5/0687]]
  3 KB (372 words) - 08:21, 21 February 2024
• Patent Applications Report for 10th Nov 2023
  ...td. has filed patents in the areas of [[:Category:H04N19/176|H04N19/176]] (14 applications), [[:Category:H04N19/119|H04N19/119]] (12 applications), [[:Ca ...01L29/66|H01L29/66]] (15 applications), [[:Category:H01L29/78|H01L29/78]] (14 applications), [[:Category:H01L29/66795|H01L29/66795]] (10 applications), [
  28 KB (3,504 words) - 04:04, 4 December 2023
• FUJIFILM Business Innovation Corp. patent applications on March 28th, 2024
  IPC Code(s): B65H1/14, B65H3/66 ...an arbitrary ascent or descent position of the load unit.[[Category:B65H1/14]][[Category:B65H3/66]][[Category:fujifilm business innovation corp.]]
  80 KB (11,918 words) - 08:15, 11 April 2024
• Apple Inc. patent applications on April 4th, 2024
  IPC Code(s): G02B27/01, G06F3/14 ...ject within a performance threshold.[[Category:G02B27/01]][[Category:G06F3/14]][[Category:apple inc.]]
  51 KB (8,114 words) - 07:30, 10 April 2024
• Patent Applications Report for 12th Apr 2024
  Number of patent applications containing '5G Technologies' or its variations: 14 ...9/176|H04N19/176]] (20 applications), [[:Category:H04N19/132|H04N19/132]] (14 applications), [[:Category:H04N19/70|H04N19/70]] (10 applications), [[:Cate
  48 KB (5,904 words) - 09:33, 12 April 2024
• Patent Applications Report for 28th Apr 2023
  ...:Category:G06F1/20|G06F1/20]] (6 applications), [[:Category:H05K7/14|H05K7/14]] (5 applications), [[:Category:G06F1/3234|G06F1/3234]] (4 applications) ...HIKI KAISHA has filed patents in the areas of [[:Category:B60W50/14|B60W50/14]] (10 applications), [[:Category:B60W60/00|B60W60/00]] (9 applications), [[
  35 KB (4,354 words) - 01:42, 3 January 2024
• Patent Applications Report for 5th May 2023
  ...Inc. has applied for patents in the areas of [[:Category:B60L53/14|B60L53/14]] (2), [[:Category:H02G5/06|H02G5/06]] (1), [[:Category:H02G5/061|H02G5/061 .... has filed patents in the areas of [[:Category:H04W72/0453|H04W72/0453]] (14 applications), [[:Category:H04W24/02|H04W24/02]] (6 applications), [[:Categ
  38 KB (4,550 words) - 01:48, 3 January 2024
• Patent Applications Report for 5th Jan 2024
  ...TD. has filed patents in the areas of [[:Category:H10K59/122|H10K59/122]] (14 applications), [[:Category:H10K59/40|H10K59/40]] (12 applications), [[:Cate ...gory:B60W10/06|B60W10/06]] (10 applications), [[:Category:B60W50/14|B60W50/14]] (8 applications), [[:Category:B60W20/15|B60W20/15]] (6 applications), [[:
  38 KB (4,598 words) - 11:03, 5 January 2024
• Patent Applications Report for 13th Jan 2023
  ...gory:H04W72/04|H04W72/04]] (11 applications), [[:Category:H04W72/14|H04W72/14]] (8 applications) ...Ltd. has filed patents in the areas of [[:Category:H01L27/32|H01L27/32]] (14 applications), [[:Category:H01L51/56|H01L51/56]] (12 applications), [[:Cate
  38 KB (4,677 words) - 01:14, 2 January 2024
• Patent Applications Report for 22nd Dec 2023
  [[:Category:NVIDIA Corporation|NVIDIA Corporation]]: 14 patent applications[[Category:NVIDIA Corporation]] ...HIKI KAISHA has filed patents in the areas of [[:Category:B60W50/14|B60W50/14]] (8 applications), [[:Category:B60K35/00|B60K35/00]] (6 applications), [[:
  38 KB (4,611 words) - 06:09, 1 January 2024
• Patent Applications Report for 22nd Mar 2024
  ...5]] (2), [[:Category:H04M3/51|H04M3/51]] (2), [[:Category:H04L67/14|H04L67/14]] (2), [[:Category:H04L65/403|H04L65/403]] (2) ...L29/775|H01L29/775]] (20 applications), [[:Category:H01L29/06|H01L29/06]] (14 applications), [[:Category:H01L23/00|H01L23/00]] (13 applications), [[:Cate
  49 KB (5,967 words) - 08:04, 22 March 2024
• Patent Applications Report for 9th Feb 2024
  ...2/04|H04W72/04]] (17 applications), [[:Category:H04W72/0453|H04W72/0453]] (14 applications) ...ategory:G03G15/00|G03G15/00]] (5 applications), [[:Category:B41J2/14|B41J2/14]] (5 applications), [[:Category:B41J2/175|B41J2/175]] (5 applications), [[:
  46 KB (5,558 words) - 04:10, 9 February 2024
• NEC Corporation patent applications on April 11th, 2024
  IPC Code(s): G01D21/02, G01D3/00, G01D15/14 ...surement data.[[Category:G01D21/02]][[Category:G01D3/00]][[Category:G01D15/14]][[Category:nec corporation]]
  60 KB (9,042 words) - 08:24, 12 April 2024
• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
  IPC Code(s): H01L23/538, H01L21/56, H01L21/683, H01L23/00, H01L23/14, H01L23/31, H01L23/498 ...:H01L21/56]][[Category:H01L21/683]][[Category:H01L23/00]][[Category:H01L23/14]][[Category:H01L23/31]][[Category:H01L23/498]][[Category:taiwan semiconduct
  105 KB (15,276 words) - 04:53, 11 April 2024
• NEC Corporation patent applications on February 29th, 2024
  IPC Code(s): G06Q30/0251, G06Q50/14, G06V40/16 ...displayed on the display devices.[[Category:G06Q30/0251]][[Category:G06Q50/14]][[Category:G06V40/16]][[Category:nec corporation]]
  57 KB (8,554 words) - 04:59, 4 March 2024
• Meta Platforms Technologies, LLC patent applications on March 21st, 2024
  ...Code(s): G01B11/25, G02B6/12, G02B27/00, G02B27/01, G06V40/18, H01S5/183, H01S5/40 ...Category:G02B27/01]][[Category:G06V40/18]][[Category:H01S5/183]][[Category:H01S5/40]][[Category:meta platforms technologies, llc]]
  50 KB (7,667 words) - 07:42, 22 March 2024
• Sony Group Corporation patent applications on May 16th, 2024
  IPC Code(s): H01S5/323, H01S5/042, H01S5/22 ...er to the substrate.[[Category:H01S5/323]][[Category:H01S5/042]][[Category:H01S5/22]][[Category:sony group corporation]]
  64 KB (9,494 words) - 01:08, 24 May 2024

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