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Create the page "H01L23/60" on this wiki! See also the search results found.
- ...as of innovation include H01L25/0652 (1 patents), H01L23/3672 (1 patents), H01L23/552 (1 patents), and they have worked with companies such as TESLA, INC. (1 * [[:Category:CPC_H01L23/3672|H01L23/3672]] ({Foil-like cooling fins or heat sinks (being part of lead-frames):3 KB (386 words) - 15:52, 12 July 2024
- ...as of innovation include H01L25/0652 (1 patents), H01L23/3672 (1 patents), H01L23/552 (1 patents), and they have worked with companies such as TESLA, INC. (1 * [[:Category:CPC_H01L23/3672|H01L23/3672]] ({Foil-like cooling fins or heat sinks (being part of lead-frames):3 KB (384 words) - 15:52, 12 July 2024
- ...as of innovation include H01L25/0652 (1 patents), H01L23/3672 (1 patents), H01L23/552 (1 patents), and they have worked with companies such as TESLA, INC. (1 * [[:Category:CPC_H01L23/3672|H01L23/3672]] ({Foil-like cooling fins or heat sinks (being part of lead-frames):3 KB (384 words) - 15:52, 12 July 2024
- ...as of innovation include H01L23/3735 (1 patents), H01L21/4882 (1 patents), H01L23/3736 (1 patents), and they have worked with companies such as Tesla, Inc. ( * [[:Category:CPC_H01L23/3735|H01L23/3735]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents4 KB (608 words) - 07:03, 13 July 2024
- ...patents. Their primary areas of innovation include H01L23/367 (3 patents), H01L23/544 (2 patents), H01L2223/54426 (2 patents), and they have worked with comp * [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 3 patents5 KB (628 words) - 07:03, 13 July 2024
- ...patents. Their primary areas of innovation include H01L23/367 (3 patents), H01L23/544 (2 patents), H01L2223/54426 (2 patents), and they have worked with comp * [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 3 patents4 KB (628 words) - 07:03, 13 July 2024
- ...r has an opening with a scallop sidewall and an included angle larger than 60 degrees. * Dielectric layer has opening with scallop sidewall and included angle over 60 degrees3 KB (463 words) - 02:22, 6 June 2024
- IPC Code(s): H01L23/00, H01L23/48, H01L23/528, H01L23/66 [[Category:H01L23/00]][[Category:H01L23/48]][[Category:H01L23/528]][[Category:H01L23/66]][[Category:sk hynix inc.]]12 KB (1,868 words) - 09:01, 30 January 2024
- [[Category:H01L23/60]] [[Category:H01L23/00]]3 KB (508 words) - 18:45, 20 June 2024
- [[Category:H01L23/60]] [[Category:H01L23/00]]4 KB (550 words) - 17:11, 21 June 2024
- ...r has an opening with a scallop sidewall and an included angle larger than 60 degrees. ...ace of the dielectric layer and the sidewall of the opening is larger than 60 degrees, but it does not explain how this angle affects the device's functi4 KB (550 words) - 08:07, 31 May 2024
- [[Category:H01L23/60]] [[Category:H01L23/367]]3 KB (367 words) - 09:23, 25 January 2024
- * The silicon content (x) in the etch stop layer ranges from 30% to 60%. * The carbon content (y) in the etch stop layer ranges from 25% to 60%.4 KB (575 words) - 05:33, 2 February 2024
- [[Category:H01L23/60]] [[Category:H01L23/13]]4 KB (559 words) - 05:56, 13 August 2024
- [[Category:H01L23/60]] [[Category:H01L23/13]]4 KB (549 words) - 06:42, 8 August 2024
- [[Category:H01L23/04]] [[Category:H01L21/60]]4 KB (527 words) - 09:57, 19 September 2024
- [[Category:H01L23/04]] [[Category:H01L21/60]]4 KB (540 words) - 06:54, 19 September 2024
- [[Category:H01L23/498]] [[Category:H01L21/60]]3 KB (503 words) - 16:47, 20 April 2024
- [[Category:H01L23/498]] [[Category:H01L21/60]]4 KB (521 words) - 04:29, 26 April 2024
- [[Category:H01L23/00]] [[Category:H01L23/498]]4 KB (573 words) - 03:24, 28 June 2024